Kaneka Corporation

Takao Manabe

Makoto Seino

Masahito Ide

Satoshi Sugiyama

Shinya Mizuta

Hiroyuki Tanaka

Hirofumi Inari

Aki Kitajima

Yoshitaka Nishiyama

Komei Tahara

Mitsuhiro Hori

Akira Takaki

Kazunori Saegusa

Tomomichi Hashimoto

Masashi Sakaguchi

Kentaro Takesada

Susumu Amano

Kazuaki Kanai

Tomokazu Tozawa

Yoshikatsu Ichiryu

Takahisa Iwahara

Takao Michinobu

Shuhei Ozaki

Hiroshi Ogoshi

Kazuhiko Hirabayashi

Yasushi Kakehashi

Ryoichi Narita

Satoaki Iba

A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Photosensitive composition, colored pattern and method for producing same

The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

Polysiloxane composition, hardened material and optical device

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 &#x3bc;m to 10 &#x3bc;m, the glass transition temperature of the cured resin body is 10&#xb0; C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of &#x2212;50 to 250&#xb0; C., a temperature elevation rate of 5&#xb0; C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180&#xb0; C. for 72 hours is 90% or more.

Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

An object of the present invention is to provide a polyhedral polysiloxane composition that has high heat resistance and high light resistance, is excellent in gas-barrier properties and thermal shock resistance, and exhibits good handleability when used to encapsulate an optical semiconductor device. The polyhedral polysiloxane composition of the present invention is characterized by including a modified polyhedral polysiloxane which is obtained by hydrosilylation of an alkenyl group-containing polyhedral polysiloxane compound (a) and a hydrosilyl group-containing compound (b) and has a structure derived from an organic silicon compound (a') having one alkenyl group per molecule.

Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device

The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Positive photosensitive composition, thin film transistor, and compound

An object of the present invention is to provide a polysiloxane compound that can be developed in an aqueous alkali solution and can yield a cured product or thin film having superior heat-resistant transparency and insulating properties, a curable composition thereof, and a thin film transistor provided with a passivation layer or gate insulator using the same, and the present invention relates to a polysiloxane compound having at least one photopolymerizable functional group in a molecule thereof, and having at least one member selected from the group consisting of an isocyanuric acid backbone structure, a phenolic hydroxyl group and a carboxyl group within the same molecule, to a curable composition containing the polysiloxane compound, and to a cured product thereof.

Alkali-developable curable composition, insulating thin film using the same, and thin film transistor

The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Polyhedral polysiloxane modified product and composition using the modified product

It is an object of the present invention to provide: a curable composition that has photocurability and provides a cured product excellent in insulating properties; and the cured product. This can be achieved by a photocurable composition that contains, as essential components, (A) a modified polyorganosiloxane compound having a photopolymerizable functional group and an SiH group, (B) a compound having a carbon-carbon double bond, and (C) a photopolymerization initiator. A thin film produced from the curable composition of the present invention has excellent insulating properties. Since the curable composition of the present invention can form a film by solution coating, it is applicable to provide thin-film insulating materials that can be formed by solution coating.

Photocurable composition and cured product

A polysiloxane composition having high transparency, while being excellent in heat resistance and light resistance is provided. The polysiloxane composition is composed of (A) a polysiloxane which is a polysiloxane compound having a polyhedral skeleton having 6 to 24 silicon atoms in its molecule and which has at least one group containing a hydrolyzable silyl group bonded to a Si atom constituting the polyhedral skeleton, and (B) a photoacid generator. The hydrolyzable silyl group is preferably an alkoxysilyl group.

Polysiloxane composition

The present invention provides a polysiloxane composition maintaining high transparency over a wide wavelength region and a wide temperature region and being excellent in heat resistance, low-dielectric characteristics, workability, and the like. A polysiloxane composition includes (A) a polysiloxane which is composed of a polysiloxane compound having a polyhedral skeleton having 6 to 24 Si atoms in its molecule and which has at least one alkenyl group bonded directly or indirectly to a Si atom constituting the polyhedral skeleton, (B) a polysiloxane having a hydrosilyl group, and (C) a hydrosilylation catalyst.

Growing community of inventors

Settsu, Japan

Takao Manabe