Nec Corporation

Takao Koizumi

Yuhei Kosugi

Akio Kuramoto

Kousuke Tanabe

A physically small antenna having a wide bandwidth that facilitates the inspection of the attachment to the printed circuit board. The antenna is provided with a dielectric plate having a rear surface, a conductive plate disposed on the rear surface, a vertical element extending in a direction perpendicular to the rear surface. The vertical element includes a dielectric bar, an end of which is attached to the rear surface, and a conductive shell covering a side and an opposite end of the dielectric bar to be attached to the conductive plate.

Physically small antenna

An apparatus for inspecting bump junctions in a semiconductor flip chip mounting which is able to inspect a state of a junction portion, has a simple structure and is safe and suitable for mass production of semiconductor devices and a method of inspecting the same; in an apparatus for inspecting bump junction in semiconductor flip chip mounting in which a semiconductor bare chip is mounted reversely on a substrate through the bumps, the surface of the semiconductor bare chip is irradiated with a laser light and radiation heat from the heated chip is detected with an infrared camera, a computer acquires temperature distribution on the chip surface from a picture processing unit and analyzes the temperature distribution, thereby to decide the quality of the bump junction state, and decision processing is performed by acquiring data of temperature distribution from a reference semiconductor device of known excellent quality in advance by the same method and comparing with these data.

Apparatus for inspecting bump junction of flip chips and method of

A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first holes. The upper- and lower-surface grounds are formed on upper and lower surfaces of the multilayer dielectric substrate, respectively, and the upper-surface ground has an opening portion for waveguide coupling. The antenna pattern is formed on an interlayer of the multilayer dielectric substrate by a high-frequency signal line in correspondence with the opening portion. The plurality of shield via holes are formed around the antenna pattern and filled with a filler material to form a pseudo waveguide structure. The first holes have cavities formed in the multilayer dielectric substrate in correspondence with the pseudo waveguide structure between the antenna pattern and the opening portion of the upper-surface substrate. A method of manufacturing this circuit module is also disclosed.

Method of manufacturing a composite microwave circuit module

A high-frequency device package includes a base, a high-frequency device mounted on the base and having a power supply electrode, a signal electrode, and a ground electrode disposed on a surface thereof, a plurality of leads electrically connected respectively to the power supply electrode, the signal electrode, and the ground electrode using a tape carrier, and a resin body sealingly encasing the high-frequency device. The resin body is formed by dropping a molten resin mass onto the base in covering relation to the high-frequency device and thereafter solidifying the dropped resin mass to sealingly encase the high-frequency device.

High-frequency device package

Composite microwave circuit module having a pseudo-waveguide structure

The invention provides a circuit element mounting structure including (a) a substrate having a pattern A of wirings therein, (b) at least one cavity formed at a surface the substrate, and (c) a cap for covering the cavity therewith, the cap including a pattern B of wirings therein and a recess for electrically connecting the pattern B of wirings the pattern A of wirings. The substrate includes a protrusion for electrically connecting connection B to the pattern A of wirings. The recess and protrusion are configured to engage each other. In accordance with the invention, it is now possible to mount circuit elements on a cap which had been a dead space in prior circuit, and hence also possible to mount circuit elements in higher density on a substrate including a cap zone.

Growing community of inventors

Tokyo, Japan

Takao Koizumi