Chisso Corporation

Takao Kawamoto

Kazutsune Kikuta

Shiro Konotsune

Kouichi Kunimune

Hitoshi Yano

A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.

Method for producing printed circuit boards

A polyimide having a low elastic modulus and also superior heat resistance and mechanical characteristics and soluble in solvents and a process for producing the same are provided,

Polyamide having a low elastic modulus and a process for producing the

A crystalline polyimide polymer having a practical effectiveness that extrusion or injection molding which has so far been applied to thermoplastic resins, but could not have been achieved by conventional polyimides, are possible due to its melting point in the range of 300.degree. C. to 450.degree. C., and a process for producing the polymer, are provided, which polyimide polymer contains the following imide repetition unit (I) in 30% by mol based on the polymer and containing or not containing at least one of other imide repetition units and also having an inherent viscosity of 0.1 to 5 dl/g in conc. sulfuric acid at 30.+-.0.01.degree. C.: ##STR1## wherein X is divalent CO, divalent SO.sub.2 group, S, O or a single bond.

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Kawasaki-shi, Japan

Takao Kawamoto