Dai Nippon Printing Co., Ltd.

Takao Ikezawa

Masachika Masuda

Yo Shimazaki

Hiroyuki Saito

Kenji Matsumura

Masaru Fukuchi

Tomoya Kawashima

Yusuke Nakamura

Keisuke Miura

Yusuke Hagiwara

Norio Ishii

Makoto Yamaki

Satoru Nishima

A light control member and a light control device in which a non-electrode region is less visible. A light control film is a light control member having controllable transmissivity and includes: an undivided first common electrode; divided first electrodes; a first liquid-crystal layer disposed between the first common electrode and the first electrodes; an undivided second common electrode; divided second electrodes; and a second liquid-crystal layer disposed between the second common electrode and the second electrodes. First non-electrode lines dividing the first electrodes and second non-electrode lines dividing the second electrodes are arranged at positions not overlapping one another when viewed in the direction normal to the light control film.

Light control member and light control device

A method for manufacturing a laminated glass whereby, in a laminated glass comprising a liquid crystal film sandwiched therein and having a three-dimensionally curved surface shape, the formation of wrinkles in the liquid crystal film can be suppressed; and a laminated glass which has a three-dimensionally curved surface shape and in which wrinkles in a liquid crystal film sandwiched therein are suppressed. The method for manufacturing the laminated glass comprises: a heat molding step for heating the liquid crystal film to a temperature higher than the glass transition point of the first base material layer and the second base material layer; and a bonding step for, after completing the heat molding step, heating the laminate, wherein the liquid crystal film is sandwiched between the first glass sheet and the second glass sheet, at a temperature lower than the glass transition point and bonding the same by applying a preset pressure.

Method for manufacturing laminated glass, laminated glass and light control film

A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 &#x3bc;m or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member

Growing community of inventors

Shinjuku-ku, Japan

Takao Ikezawa