Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Takao Hosokawa

Hiroyuki Baba

Yasunobu Yoneda

Yoshiaki Kohno

Shigekatsu Yamamoto

Masataka Mae

Shigeyuki Horie

Koji Kato

Shigeki Saito

A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.

Plating apparatus and plating method

A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.

A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.

Capacitor and method for manufacturing the same

Provided is a flat Ni particle which has a large specific surface area, permitting efficient binder removal when the flat Ni particle is used for internal electrodes of a laminated ceramic electronic component. The flat Ni particle has a thickness t (m), a specific gravity &#x3c1; (g/m), and a radius r (m), and a specific surface area S(m/g), such that the specific surface area Sis adapted to have a relationship of 1.5&#xd7;S&#x3c;S&#x3c;1.9&#xd7;Swith a theoretical specific surface area in the case of assuming a surface to be completely smooth, represented by S=2/(&#x3c1;&#xd7;t)+2&#x221a;2/(&#x3c1;&#xd7;r) (m/g).

Flat Ni particle, laminated ceramic electronic component using flat Ni particle, and production method flat Ni particle

When the step of transferring a ceramic green sheet held on a chuck head having a holding surface with a plurality of vacuum ports distributed thereon onto a depositing table is repeated to obtain a laminated product, undesired deformation or damage is produced on the ceramic green sheet due to negative pressure applied to the chucking port and an obtained monolithic ceramic electronic component becomes defective by aligning of portions having the deformation or the damage in the depositing direction. In order to solve this problem, when transferring of the ceramic green sheet is repeated in the depositing step, the relative positions of the chuck head and the depositing table are shifted so as to bringing the chucking port into the same position during a first transferring step and a subsequent second transferring step.

Manufacturing method of monolithic electronic components

The present invention provides a method for manufacturing an electronic component of laminated ceramics such as a laminated ceramic capacitor in which, when a ceramic paste is applied on a ceramic green sheet in order to substantially eliminate steps caused by the thickness of a film of inner circuit elements such as an inner electrode, the ceramic paste is prevented from generating a gap between the paste and the film of inner circuit elements, or the thickness of the ceramic paste is prevented from being increased, by allowing the paste to overflow the film of inner circuit elements, even when the application position has been a little shifted, wherein an inclined face is formed at the periphery of an inner electrode that serves as the film of inner circuit elements, the ceramic paste being applied so as to overlap the periphery of the inner electrode, and wherein the used ceramic paste contains about 40% by weight to 85% by weight of solvents in order to facilitate smooth leveling of the applied ceramic paste.

Method for manufacturing electronic component of laminated ceramics

A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique comprises disposing a plurality of non-spherical conductive elements in a plating barrel, disposing a plurality of electronic parts in the plating barrel, and rotating the plating barrel to form the plated films on the external electrodes of the electronic parts.

Technique for manufacturing electronic parts

A metal thin film having excellent transferability onto a ceramic sheet is provided in order to facilitate formation of an internal electrode for a multilayer ceramic capacitor, for example, by a technique of transferring a metal thin film. A first metal layer (2) of nickel or copper or another metal is formed on a film (1) by vapor deposition, and then a second metal layer (3) of nickel or copper or another metal is formed on the first metal layer (2) by wet plating such as electroplating or electroless plating, thereby providing a metal thin film constituted by the first and second metal layers (2 and 3) having excellent transferability.

Method of preparing metal thin film having excellent transferability

To improve transferability for stacking ceramic green sheets through a transfer technique, a ceramic green sheet formed on a first back film is heated and pressurized by rolls so as to be transferred to a second back film. Thereafter, the transferred ceramic green sheet is compression bonded through a contact surface defined by a surface exposed by separation of the first back film to at least one other ceramic green sheet which has been already stacked.

Method of stacking ceramic green sheets

A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board. An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.

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Nagaokakyo, Japan

Takao Hosokawa