Max Co., Ltd.

Renesas Technology Corp.

Mitsubishi Denki Kabushiki Kaisha

Tokuyama Corporation

Takao Hasegawa

Atsushi Kurabayashi

Toru Yoshie

Naoki Kojima

Katsuya Nakamura

Katsunori Manabe

Yoshiaki Koga

Tomoaki Sakata

Masaru Ando

Hiroyuki Ookubo

Tsunehiro Koyama

A paper-processing apparatus is provided with a paper-transferring section containing a transfer path for transferring a sheet of paper to a prescribed position and a transfer path to which the transfer route is switchable from the transfer path, a punch-processing section for punching two or more holes for binding in one end of the sheet of paper transferred thereto, and a control section for controlling the paper-transferring section and the punch-processing section wherein the control section controls the paper-transferring section to decelerate and stop the transfer of the sheet of paper at the prescribed position of the transfer path, to switch the transfer route for the sheet of paper from the transfer path to the transfer path, and to deliver the sheet of paper in a reverse direction thereof. The sheet of paper can be transferred to the punch-processing section with the sheet-shaped figure of the sheet of paper kept as it is, and the holes for binding can be punched at one end of the sheet of paper.

Paper-processing and punching apparatus

A binding processing apparatusis provided with a punch mechanismand a binding processing mechanismfor executing a binding processing by a binder. When a sheet P is fed from a printing apparatusof a copier or the like, the sheet is butted to a stopper plateof the punch mechanism, sheet aligning sliderspush both left and right sides thereof to position and punch holes are formed by a punch blockand a die. Thereafter, the sheet is fed to a sheet trayof the binding processing mechanism, one set of the sheets are aligned and a ring shape binder is pinched by a pusherto fit the ring shape binder to the punch holes of the sheets, and a brochure subjected to a binding processing is discharged to a stack tray. A binder cartridgecan contain a number of the binders and the binding processing can be executed continuously.

Binding processing apparatus

On the one surface of a back plate suited to a length-and-width size of a ring binder, hooks serving as an engaging means are formed. The back plate is fixed to the spine surface of the file cover. When the ring binder is pressed against the back plate, the hooks are engaged with the ring binder so that the file cover is mounted on a booklet bound with the ring binder.

Back plate and file cover for ring binder

In a staple case provided with a staple pull-out opening and a lower face opening, a roll staple is contained, so that the staple case can be directly installed in a staple cartridge. When the staple cartridge is loaded in an electric stapler, a staple-feeding roller is in contact with the roll staple. As the staple-feeding roller rotationally drives the roll staple, a leading edge of the roll staple is fed to a leading edge of a guide portion of the staple cartridge through the staple pull-out opening.

Staple case

The invention provides metal-silica polymeric flocculants having high coagulation performance which are used for water treatment, particularly to remove suspended materials and other impurities from irrigation water, waste water or the like. A silica sol having a SiOconcentration of from 100 to 200 g/L and a viscosity of less than 6 cp is prepared by colliding an inorganic acid aqueous solution with a silicate aqueous solution at each rate of 5 m/sec or more. The silica sol is aged to make an aged silica sol having a viscosity of 6 to 30 cp, and the aged silica sol is mixed with a water-soluble metal salt such as ferric chloride, to prepare the flocculants.

Process for preparing a flocculant for water treatment

A layout device includes a processing type setting part for classifying a layout of a semiconductor integrated circuit in every area in accordance with the percentage voltage drop in the circuit, and for extracting a processing target portion composed of a group of areas, including an area having a percentage voltage drop exceeding a predetermined threshold; a layout generating part for applying layout change processing to alleviate differences of the percentage voltage drops among the areas for circuit components, such as power supply wiring and connecting points in the processing target portion.

Layout device

A document binding apparatus is formed to be mounted on an upper surface of a laser beam printer or the like. A paper discharged from the printer is fed to a paper guide, and a paper detecting sensor is turned ON to start the document binding apparatus. The paper is fed to a binding table through a paper lead-in roller, and a paper arranging pusher and a paper arranging rotation brush arrange the paper put on the binding table and an electromotive stapler binds the paper. After the staple process, a paper discharge roller holds the paper and discharges it to a stack tray.

Document binding apparatus

The wiring method includes determining wirings based on a condition that one through-hole is formed; picking up a pair of wirings that are disposed on different layers and that need to be electrically connected to each other, from among the determined wirings, and extracting areas occupied by the wirings; making a decision about whether there exist areas that coincide with each other between the wirings; making a decision about whether the coincident areas have space sufficient for an additional through-hole; and setting an additional through-hole on the coincident areas with sufficient space.

Method of wiring semiconductor integrated circuit, semiconductor integrated circuit, and computer product

There is a standard for a timing gap between the timing of signals flowing in two signal lines and changing from low logic levels. The signal lines are made longer so that the timing gap between the times when signals flowing in the two signal lines change from their low logic levels is maximized yet within the standard.

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Tokyo, Japan

Takao Hasegawa