Honda Motor Co., Ltd.

Takao Endo

Toshihide Tanaka

Shinichi Yataka

Kenji Kitamura

Kenji Miyanaga

Hiroshi Kunieda

Koichiro Sato

Yosuke Suzuki

Naofumi Sugai

Yuujiro Tominaga

A flow inspection method includes: a flow step of making powder resin flow in a housing portion of a flow tank; a viscosity measurement step of measuring a viscosity of the powder resin flowing in the housing portion; and a judgment step of judging whether or not an estimate of a bulk density of the powder resin flowing in the housing portion is less than or equal to a bulk density permissible value, the estimate being obtainable from a correlation, calculated in advance, between the bulk density and a viscosity of the powder resin flowing in the housing portion, and a measured value of the viscosity obtained in the viscosity measurement step.

Powder resin flow inspection method and powder resin flow inspection apparatus

A semiconductor module includes: a semiconductor element () having a working unit () and a guard ring unit (); and heat radiation members () arranged on an upper surface and a lower surface of the semiconductor element for cooling the semiconductor element. A passivation film () covers the guard ring but does not cover the working unit. The upper heat radiation member () is made of a flat metal plate connected to the working unit without contact with the passivation film. The upper heat radiation member is connected to the lower heat radiation member () in the thermo-conducting way.

Semiconductor device module structure

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Sayama, Japan

Takao Endo