Murata Manufacturing Co., Ltd.

Murata Manufactinrg Co., Ltd.

Takanori Uejima

Hiromichi Kitajima

Yuji Takematsu

Naoya Matsumoto

Dai Nakagawa

Yukiya Yamaguchi

Hisanori Murase

Tetsuro Harada

Yutaka Sasaki

Motoji Tsuda

Koji Furutani

Norio Nakajima

Naoki Nakayama

Koji Tanaka

Nobuaki Ogawa

Hideki Muto

Takahiro Watanabe

Kiyoshi Aikawa

Yuki Asano

Shota Hayashi

Yuuki Fukuda

Mitsunori Samata

Takahiro Eguchi

Katsunari Nakazawa

Masanari Miura

Masahide Takebe

Yoshihito Otsubo

Satoshi Arayashiki

Satoshi Goto

Atsushi Ono

Shunji Yoshimi

Yoshiaki Sukemori

Muneyoshi Yamamoto

Shogo Yanase

Kunihiro Koyama

Tatsuya Tsujiguchi

Morio Takeuchi

Masayuki Aoike

Takashi Yamada

Kunitoshi Hanaoka

Saneaki Ariumi

Hisao Hayafuji

Hiroyuki Nagamori

Yoshihiro Daimon

Takahiro Kitazume

Sho Matsumoto

Akihiro Muranaka

Shou Matsumoto

Shinya Watanabe

Masaki Kimura

Nanami Yumura

Yuto Aoki

Yuki Fukuda

Syunsuke Kido

Yoichi Sawada

Masanori Kato

Ken Tonegawa

Takeshi Kogure

Yukiteru Sugaya

Masashi Hayakawa

Osamu Shibata

Tadaji Takemura

Motohiko Kusunoki

Naoto Yamaguchi

Ryohei Okabe

Syuji Yamato

Masakazu Hirobe

Yoshiki Takada

Tomomi Yasuda

Takahiro Katamata

Hiroki Fujiwara

Naru Morito

Mayuka Ono

Takuma Kuroyanagi

Masateru Higashi

Yuusuke Suzuki

Jun Takahara

Hidehiro Takano

Koki Saito

A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.

Radio frequency module and communication device

A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.

A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

High-frequency module

A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.

Electronics module with shield structure

A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.

Radio-frequency module and communication device

A radio frequency module includes submodules and a connection board that connects the submodule and the submodule. The submodule includes a module board and a first component arranged on the module board, the submodule includes a module board and a second component arranged on the module board, and the connection board is directly connected to the module boards and electrically connects the first component and the second component.

An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.

Integrated circuit and radio-frequency module

A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side.

Module

A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

Radio-frequency module and communication apparatus

A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.

A radio frequency module includes: a radio frequency input terminal for receiving an amplified transmission signal from the outside; radio frequency output terminals for supplying a reception signal to the outside; a filter connected between the radio frequency input terminal/the radio frequency output terminal and an antenna connection terminal, and having a passband including communication band D for TDD; and a filter connected between the radio frequency output terminal and the antenna connection terminal and having a passband including at least part of communication band A allowed for simultaneous communication with communication band D. The radio frequency input terminal is arranged in a region extending along a side of the module substrate, and the radio frequency output terminal is arranged in a region extending along a side facing the side of the module substrate.

A radio frequency module includes a module substrate, a first component disposed on a principal surface side of the module substrate, a metal shield wall disposed on an upper surface of the first component and set to ground potential, a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of the metal shield wall, and a metal shield layer set to the ground potential and covering an upper surface of the resin member. An upper end of the metal shield wall is in contact with the metal shield layer. The first component includes a first terminal and a second terminal both connected to the module substrate. When the principal surface is viewed in plan, the metal shield wall is disposed between the first terminal and the second terminal.

A radio frequency module is reduced in height. A radio frequency module includes a mounting substrate, a filter, and a conductive member. The mounting substrate has a first main surface and a second main surface opposite to each other. The filter is mounted on the first main surface of the mounting substrate. The conductive member covers at least part of a main surface of the filter on a side opposite to the mounting substrate. The first main surface of the mounting substrate has a recess. The main surface of the filter is in contact with the conductive member. At least part of the filter is positioned inside the recess.

A radio-frequency module includes a switch; power amplifiers; a transmission filter that has a passband including a transmission band of a communication band A included in a communication band group X and that has one end connected to an antenna connection terminal via the switch and the other end connected to an output of the power amplifier; a transmission filter that has a passband including a transmission band of a communication band C included in a communication band group Y lower than the communication band group X and that has one end connected to the antenna connection terminal via the switch and the other end connected to an output of the power amplifier; and a module substrate. In a plan view of the module substrate, a distance between the power amplifier and the switch is shorter than a distance between the power amplifier and the switch.

Radio-frequency module

A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel to the major face and spaced apart from the major face, the joint part extending from the shield part. A top face of at least one of the first circuit component and the second circuit component is connected with the joint part by a bonding wire. With the module substrate seen in plan view, the metal shield plate is disposed between the first circuit component and the second circuit component.

Growing community of inventors

Nagaokakyo, Japan

Takanori Uejima