Lintec Corporation

Fsk Kabushiki Kaisha

Takanori Saito

Kazuyoshi Ebe

Ichiro Tsuchida

Shigenobu Maruoka

Katsuhisa Taguchi

Hideaki Okabe

Mikio Komiyama

Yasunao Miyazawa

Hiroaki Narita

Yoshitaka Akeda

Eiji Suzuki

Masao Kogure

Yasuyuki Amano

Eiji Aizawa

Kazuhiro Takahashi

Satoru Shoshi

Toshio Sugizaki

Kazuhiro Kon

Shunpei Watanabe

Yasukazu Nakada

Kouji Irie

A transdermal therapeutic formulation is made of a composition comprising a polymer and ingredients mixed with the polymer which are a pharmacologically active substance, an alcohol, a percutaneous absorption promoter utilized according to necessity and water utilized according to necessity. The polymer comprises lipophilic monomer units and hydrophilic monomer units in a specific ratio. The alcohol, the percutaneous absorption promoter and water are mixed with the polymer in specific amounts. The transdermal therapeutic formulation has excellent percutaneous absorption, has many kinds of applicable pharmacologically active substances, shows good stability of percutaneous absorption with time because of absence of crystallization of the pharmacologically active substance, has good adhesive strength and thus favorably utilized as transdermal therapeutic plaster.

Transdermal therapeutic formulation and a method of administration

A hard coat film having an easily slipping property which comprises a plastic film and a hard coating layer of 1 to 15 .mu.m thickness made from an ultraviolet curable resin on the plastic film, wherein the hard coating layer contains particles of a high molecular weight polyester resin dispersed therein and the surface of the hard coating layer is provided with 3 to 200 protrusions of a diameter of 0.05 to 3 .mu.m and a height of 0.01 to 2 .mu.m per 100 .mu.m.sup.2 of the surface, and a process for producing the hard coat film. The hard coat film has a low haze value, a good transparency, an excellent resistance to scratch, a low kinematic friction coefficient, and an excellent slipping property both between coated surfaces and between a coated surface and a surface having no treatment.

Hard coat film having an easily slipping property and process for

An article of manufacture in the form of a gel pharmaceutical formulation for local anesthesia is prepared by a process comprising: coating a supporting substrate, which preferably is porous, e.g., a non-woven fabric, and has an impervious backing sheet, with a matrix of a copolymer of alkyl (meth)acrylates and (meth)acrylic acid and a local anesthetic whereby the matrix penetrates the substrate, crosslinking the copolymer in the matrix to form a polymer/drug matrix, and coating the surface of the matrix with an aqueous fluid, thereby converting the matrix into a gel and preferably covering the gel matrix with an impervious protective sheet. The product has excellent percutaneous absorption, provides local anesthesia easily just by attaching the formulation to the skin, enables elimination of various kinds of pain, such as the pain at the time of hypodermic injection, can be removed easily from the skin, and causes no soiling of fingers, hands or cloths.

Gel pharmaceutical formulation for local anesthesia

A label which can conform to the deformations of a squeezable container to which it is affixed and tearing of which during container use does not occur and which can be applied to the containers continuous labeling by automatic labeling machines comprises a single or a multilayer composite polyethylene film attached to a release liner by pressure-sensitive adhesive, which film is formed from a low density polyethylene homopolymer resin and an amount of a linear low density copolymer resin of ethylene and an amount of another .alpha.-olefin effective to increase the elastic deformation of the label, either as a mixture thereof in the same layer or as separate layers formed from the homopolymer and from the copolymer, respectively, or from one of them and from a mixture of the homopolymer and the copolymer.

Label for a squeezable container and squeezable container bearing same

A percutaneous absorption promoter comprises a derivative of amino acid in which the amino group has or does not have an acyl substituent or a hydrocarbon substituent, the carboxylic group has a hydrocarbon substituent and the part between the amino group and the carboxylic group has a specified structure. A tape plaster comprises the percutaneous absorption promoter described above. The method utilizes the the percutaneous absorption promoter described above. The percutaneous promoter of the invention has excellent ability of promoting the percutaneous absorption of pharmacologically active substances and excellent safety simultaneously, capable of delivering the desired pharmacologically active substances rapidly to the location of treatment or to all parts of the body through the circulating system and effective for curing various kinds of disease. The tape plaster comprising it and the method of promoting percutaneous absorption by utilizing it have the same advantages.

Percutaneous absorption promoter, a tape plaster and a method of

An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Adhesive composition comprising (meth)acrylate polymer and epoxy resin

A plate roll attached by an adhesive sheet to a printing plate made of a resin. The attached printing plate is easily detached. The adhesive sheet and remaining adhesive are easily removed after printing is finished and the efficiency of the operation of printing is enhanced. The adhesive sheet includes a photocurable adhesive, which loses adhesive ability by curing by irradiation of electromagnetic waves or an electron beam or a water swelling adhesive, which loses adhesive ability by swelling by water. Adhesive sheets for the plate roll comprise supporting sheets, removable sheets and a photocurable adhesive, which loses adhesive ability by curing by irradiation of electromagnetic waves or an electron beam or a water swelling adhesive, which loses adhesive ability by swelling by water.

Plate roll and an adhesive sheet therefor

Disclosed is a photochromic composition comprising an organic photochromic compound and a specific tertiary amine compound which are dissolved or dispersed in a high-molecular compound. Also disclosed are a photochromic film composed of the above photochromic composition and a photochromic laminate having a photochromic layer composed of the above photochromic composition on a surface of a substrate.

Photochromic composition

A pressure sensitive adhesive sheet comprising a substrate and an adhesive composition which is coated on the surface of the substrate. The main components of the adhesive composition are (a) a copolymer comprising monomeric units of an acrylic ester, (b) monomeric units of a polar acrylic compound, (c) monomeric units of a high glass transition temperature (Tg) macromonomer having a Tg of 20.degree. C. or above, (d) monomeric units of a low Tg macromonomer having a Tg of below 20.degree. C. and (e) monomeric units of an oligomer having telechelic thiol functional groups. The pressure sensitive adhesive sheet has excellent adhesive strength, resistance against formation of blisters and removability upon heating.

Blister resistant pressure sensitive adhesive sheet

The pressure-sensitive adhesive sheet of the invention is free from the troubles of forming blisters due to the gas emission from the substrate surface to which the adhesive sheet is applied and bonded by using a unique pressure-sensitive adhesive to form the adhesive layer on a base sheet. The principal ingredient of the pressure-sensitive adhesive used in the present invention is a copolymer having a specified molecular weight and a specified glass transition temperature and composed of (a) from 50 to 85% by weight of a first monomeric moiety of an acrylic ester, e.g., 2-ethylhexyl acrylate, (b) from 1 to 30% by weight of a second monomeric moiety of an acrylic compound having a polar group, e.g., acrylic acid, and (c) from 5 to 40% by weight of a third monomeric moiety of a macromonomer having a polymeric molecular chain of styrene units and/or methyl methacrylate units and having a polymerizable functional group, e.g., methacryloyl group, at the molecular chain end.

Composite body having a blister-free pressure-sensitive adhesive sheet

An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.

Adhesive sheets

An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Growing community of inventors

Misato, Japan

Takanori Saito