Kyocera Corporation

Takanori Kubo

Hiromichi Yoshikawa

Shigeo Tanahashi

Kenji Kitazawa

Shinichi Koriyama

Masanobu Ishida

Hidehiro Minamiue

Koichi Nagata

Naoyuki Shino

Akira Nakayama

Kazuhiro Kawabata

Shigeki Morioka

A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter can receive a pair of signals, namely a differential signal, and output a single signal, namely an unbalanced signal. A transmission characteristic of the bandpass filter having an attenuation pole near both sides of the passband can be achieved.

Bandpass filter, wireless communication module and wireless communication device

A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter can receive a pair of signals, namely a balanced signal, and output a pair of signals. The bandpass filter comprises a plurality of &#xbd; wavelength resonance electrodes, a plurality of &#xbc; wavelength resonance electrodes and a plurality of coupling electrodes. A transmission characteristic of the bandpass filter having flat and low loss over the entire region of the broad pass band can be achieved.

A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

High-frequency module coupled via aperture in a ground plane

A circuit sub-assembly as a mounting for an electronic component such as Josephson device, i.e., a superconducting element, comprises a ceramic insulating substrate, an oxygen-shielding barrier layer formed on the insulating substrate, and a circuit film of niobium, as a superconducting material formed on the barrier layer according to a desired pattern. The barrier layer prevents oxidation of the circuit layer by shielding it from oxygen present in the insulating substrate. Due to the barrier layer, the circuit film is scarcely subject to superconductivity-impairing oxidation. The circuit film is thus capable of high-speed electronic signal conduction.

Superconducting circuit sub-assembly having an oxygen shielding barrier

An impedance-matching circuit assembly supplies a.c. power from an external a.c. source to Josephson devices. The assembly comprises resonant-line composed quarter-wave impedance conversion circuits, interconnected in a tree. The impedance-conversion circuits are assembled such that connected to the a.c. source is a circuit having a first-stage impedance, followed by two circuits having second-state impedances connected in parallel, to each of which are connected in parallel two circuits having third-stage impedances, each of which in turn is connected to supply input terminals of two of the Josephson devices.

Growing community of inventors

Kirishima, Japan

Takanori Kubo