Daicel Corporation

Takanori Kobatake

Katsuaki Suganuma

Yasuyuki Akai

Tomoya Egawa

Shuhei Takata

Provided are a dispersion medium for metal particle sintering that gives an electroconductive paste whereby metal particles are satisfactorily sintered at a low temperature even when not in a reducing atmosphere, and an electroconductive paste in which the dispersion medium is used. The dispersion medium for metal particle sintering according to an embodiment of the present disclosure contains formic acid and a basic compound, the basic compound being a nitrogen-containing compound represented by Formula (1), and a molar ratio (basic group/formic acid) of basic groups included in the basic compound to formic acid being from 0.50 to 1.20. [Formula 1] In Formula (1): Rto Rare the same or different and each represent a hydrogen atom or a hydrocarbon group that may have a substituent; the double line including a dashed line represents a single bond or a double bond, with Rbeing absent in the case of a double bond; and any two of Rto Rmay bond with each other and form a ring together with the adjacent nitrogen atom.

Dispersion medium for metal particle sintering, and electroconductive paste

An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 μm or greater and 10 μm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and

Adhesive conductive paste

The present invention relates to an epoxy resin composition containing an alicyclic epoxy compound (A), a polymer polyol having two or more terminal hydroxyl groups (B), and a Lewis acid-amine complex (C). The present invention provides an epoxy resin composition which can be cured by heating at low temperatures, and suppresses heat generation associated with curing (heat generation by curing). It is preferable that the epoxy resin composition further contains an antioxidant. Furthermore, it is preferable that the antioxidant is a phosphite ester compound.

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Ohtake, Japan

Takanori Kobatake