Renesas Technology Corp.

Other

Hitachi Ulsi Systems Co., Ltd.

Hitachi Yonezawa Electronics Co., Ltd

Takanori Hashizume

Masahiro Ichitani

Takashi Miwa

Noriyuki Takahashi

Kazunari Suzuki

Masayuki Suzuki

Takafumi Nishita

Kenichi Imura

Kouji Tsuchiya

Takao Matsuura

Atsushi Nakamura

Naozumi Morino

Ikuo Kudo

Saneaki Tamaki

Yasumi Tsutsumi

Masamichi Sato

A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure. Bonding leads arranged along at least one side of the substrate may include bonding leads of rectangular configuration having longer sides disposed at acute angles with respect to the side of the substrate.

Semiconductor device

A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package

The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Method of manufacturing a semiconductor device and a semiconductor device

Method of manufacturing a semiconductor device using a mold

Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture

Growing community of inventors

Higashiyamato, Japan

Takanori Hashizume