Hitachi, Ltd.

Hitachi Metals, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi High-tech Corporation

Renesas Technology Corp.

Hitachi-high-technologies Corporation

Hitachi Medical Corporation

Hitachi-lg Data Storage, Inc.

Takanori Aono

Masatoshi Kanamaru

Yoshisada Ebata

Shigeru Matsui

Yoshishige Endo

Tatsuya Nagata

Masahide Hayashi

Atsushi Kazama

Hideyuki Aoki

Ryoji Okada

Kengo Suzuki

Kenta Yaegashi

Tetsuya Watanabe

Ryuji Kohno

Akira Koide

Takashi Kobayashi

Kenji Yasuda

Tetsuo Yokoyama

Yasuhiro Yoshimura

Shuntaro Machida

Hiroshi Ogasawara

Naoki Matsushima

Naoya Kanda

Heewon Jeong

Takao Terayama

Takashi Nakahara

Shohei Hata

Hiroya Shimizu

Shinya Yuda

Toshinari Sakurai

Hiroyuki Enomoto

Naoto Ban

Katsunori Asafusa

Masakatsu Saitoh

Kei Takenaka

Tatsuya Yamasaki

Ayano Otsubo

Eiji Sakamoto

Yukiko Ikeda

Kenji Watabe

Jiro Hashizume

Isao Uchida

Yoshiaki Takada

Toshiki Kida

Yugo Onoda

Jiro Yamamoto

Kouji Akita

Yoshitaka Seki

Kiyomi Abe

Tetsu Inahara

Kenji Kawakami

The present invention provides a concave diffraction grating and an optical device using the concave diffraction grating, the concave diffraction grating being capable of preventing deformation of a reflection film due to the influence of temperature, and preventing deterioration in optical characteristic due to temperature. This concave diffraction grating is provided with: a reflection film () having a plurality of grating grooves (); a holding film () comprising metal and having one surface on which the reflection film () is provided; a concave substrate () having a concave surface (); and an affixing layer () provided between the concave surface () and the other surface of the holding film (), and affixing the holding film () and the reflection film () to the concave substrate ().

Concave diffraction grating and optical device

Easy and accurate mating of a groove interval of a groove pattern of a diffraction grating with a position on a convex fixing substrate is enabled. For this purpose, a concave diffraction grating is fabricated by: transferring a groove pattern formed on a plane diffraction grating and having unequal groove intervals onto a metal thin film; forming a first alignment mark on a convex surface of a fixing substrate having the convex surface to fix the metal thin film; mating a second alignment mark formed on an adhesive surface of the metal thin film with the first alignment mark to perform alignment; bonding the adhesive surface of the metal thin film and the convex surface of the fixing substrate to each other to fabricate a master; and transferring a groove pattern of a metal thin film of the master.

Manufacturing method of concave diffraction grating, concave diffraction grating, and analyzer using the same

The present invention provides a concave diffraction grating capable of improved diffraction efficiency by suppressing spherical aberration. The concave diffraction grating is a concave diffraction gratingfor dispersing and focusing light and comprises sawtooth grating grooveson a concave substrate, with the sawtooth grating groovesbeing unequally spaced. The concave diffraction gratingfor dispersing and focusing light is formed by preparing a planar diffraction grating with a sawtooth shape which is formed on a planar substrate by photo-lithography and etching or machining and which forms unequally spaced grating grooves, deforming and mounting the planar diffraction grating along a fixed convex substrate to obtain a mold of a concave diffraction grating, and transferring the mold of the concave diffraction grating to the surface of a metal or a resin.

Concave diffraction grating, method for producing the same, and optical device

A scanning image display device is provided that can display high-quality images even with variation in environmental conditions at a place where the device is installed. The scanning image display device includes: a laser light source that emits laser light based on image information; a scanning mirror that scans the laser light emitted from the laser light source to project an image on a projection plane; a housing that holds the laser light source and the scanning mirror; and a container formed of a base and an outer cover that accommodates the housing and is internally sealed, wherein the outer cover has a thin-wall portion that is elastically deformed with variation in pressure within the container.

Scanning image display device

A learning unit in learning mode generates a cluster from a cluster analysis of data formed from frequency constituent data and state data, obtained from a sensor unit. An abnormality calculation unit computes, as abnormalities, the minimum values among distances to surfaces of the clusters of the data formed from the frequency constituent data and the state data, obtained when in predictive fault indicator sensing mode. A predictive fault indicator determination unit determines a predictive fault indicator of an X-ray tube by comparing the abnormalities with a predetermined threshold.

X-ray tube predictive fault indicator sensing device, X-ray tube predictive fault indicator sensing method, and X-ray imaging device

The present invention includes: an excitation light source; a probe light source; a filter that mutually multiplexes a probe light emitted from the probe light source and an excitation light emitted from the excitation light source to a same optical axis; a condenser lens that focuses the excitation light and the probe light; a sample cell that stores a sample; a reflection member that is disposed on an inner wall of the sample cell and reflects the probe light; and a detector that detects the probe light reflected at the reflection member.

Photothermal conversion spectroscopic analyzer

A technique is provided which enables preparation of a curved grating having a desired curvature, by plastically deforming, along a curved substrate, a flat grating prepared by a semiconductor process on a silicon substrate, and which thus prepares a diffraction grating with high accuracy. A silicon flat grating prepared by a semiconductor process is transferred to an amorphous material, and the amorphous material substrate is curved and mounted on a curved fixed substrate, thus providing a curved grating having a crystalline material in which the generation of a dislocation line is restrained.

Curved grating, method for manufacturing the same, and optical device

A curved surface diffraction grating fabrication method for fabricating a curved surface diffraction grating having a desired curvature with high accuracy, includes: a step of forming a diffraction grating pattern on a flat-shaped silicon substrate; a step of curving the silicon substrate on which the diffraction grating pattern is formed, by pressing, in a heated state, a fixing substrate having a shape with a desired curved surface onto the silicon substrate and of fixing the silicon substrate on which the diffraction grating pattern is formed to the fixing substrate having the shape with the curved surface, to fabricate a curved surface diffraction grating cast; and a step of bringing a member having flexibility into contact with the curved surface diffraction grating cast, to transfer the diffraction grating pattern to the member.

Curved face diffraction grating fabrication method, curved face diffraction grating cast, and curved face diffraction grating employing same

To suppress variations of a vacuum pressure atmosphere in a physical sensor, a physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, includes a sensor part in which a plurality of substrates are stacked, and a cavity substratehaving a space and provided on an upper surface side or a lower surface side of the sensor part by bonding, wherein the sensing part communicates with a space of the cavity substrate via a ventilation passageprovided in the sensor part.

Structure of physical sensor

There are provided a process for fabricating MEMS device that includes a plurality of through-holes capable being arranged at a high density, the through-holes having a tapered end portion. Through-holes having vertical side surfaces and tapered bottoms are provided by a processing method including the steps of: disposing quadrilateral patterning having desired dimensions on a silicon substrate having a flat surface of a crystal plane, etching the substrate to a desired depth by dry etching that can realize a high aspect ratio etching, and anisotropic wet etching the dry etched substrate with a KOH aqueous solution containing isopropyl alcohol mixed thereinto.

Process for fabricating MEMS device

An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. A movable memberof an acceleration sensorand a vibratorof an angular velocity sensorare fabricated on the same sensor waferwith a wallinterposed therebetween. A cap waferis formed in which gapscorresponding to the movable memberof the acceleration sensorand the vibratorof the angular velocity sensorare provided. Bumpsare disposed near the gapof the angular velocity sensor. The acceleration sensoris sealed at atmospheric pressure. Then, the angular velocity sensoris subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

Combined sensor and method for manufacturing the same

An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.

Acceleration sensor

A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.

Manufacturing method of combined sensor

Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Semiconductor sensor device and method for manufacturing same

There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.

Ultrasound probe

Growing community of inventors

Tokyo, Japan

Takanori Aono