Nichia Corporation

Takanobu Sogai

Shinya Okura

Takayuki Sogo

Koji Oshodani

Takeshi Kususe

Satoshi Shichijo

Hisashi Kasai

Shusaku Bando

A light emitting device includes: a base member having a first surface including a first region; a first electric terminal including a first pin hole, the first pin hole penetrating the base member along a thickness direction of the base member; a second electric terminal including a second pin hole, the second pin hole penetrating the base member along the thickness direction; a first frame provided on the base member and surrounding the first region; a plurality of light emitting elements provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the plurality of light emitting elements; and a protective element positioned between the base member and the first frame in the thickness direction. When viewed in a direction from the first pin hole toward the second pin hole, the protective element is positioned between the plurality of light emitting elements and the first pin hole and between the plurality of light emitting elements and the second pin hole.

Light emitting device including electronic components and pin holes

A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame provided on the base member and surrounding the first region; a light emitting element provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; an electronic component provided on the base member in the second region and electrically connected with the light emitting element; and a plurality of pin holes arrayed in a first direction and electrically connected with the electronic component, the first direction being orthogonal to a thickness direction of the base member. The electronic component is provided on a side opposite the plurality of pin holes with respect to the light emitting element in a second direction that is orthogonal to the thickness direction and the first direction.

A method of manufacturing a light emitting device includes: bonding a plurality of light emitting elements each having an outer peripheral lateral surface onto a light-transmissive substrate; forming at least one groove on the light-transmissive substrate to surround an outer periphery of each of the plurality of light emitting elements; disposing at least one light guiding member in the groove to continuously cover the groove and the outer peripheral lateral surfaces of adjacent ones of the plurality of light emitting elements; and singulating the light-transmissive substrate at a position between adjacent ones of the plurality of light emitting elements, to obtain a plurality of light emitting devices in each of which at least one of the light emitting elements is bonded to a single light-transmissive member.

Method of manufacturing light emitting device having light guiding member in groove

A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame surrounding the first region on the base member; a light emitting element provided on the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; a second frame surrounding the second region; an electronic component provided in the second region; and a non-light-transmissive second member provided inward of the second frame, and covering the electronic component. A part of the first frame and a part of the second frame are integrated with each other. An upper surface of the first member is positioned higher than upper surfaces of the first frame, the second frame, and the second member.

Light emitting device

A light-emitting device includes a light-emitting element having a first upper surface serving as a light-extracting surface. A first light-transmissive member includes an inorganic material and a wavelength conversion member and has a plate shape including a first lower surface bonded to the first upper surface and a second upper surface. An outer periphery of the first lower surface is outside of an outer periphery of the first upper surface. The second upper surface is opposite to the first lower surface in a height direction along a height of the light-emitting device. The second light-transmissive member includes an inorganic material and includes a second lower surface bonded to the second upper surface and a third upper surface opposite to the second lower surface in the height direction. An outer periphery of the third upper surface is within an outer periphery of the second upper surface.

Light-emitting device and method of manufacturing the same

A light emitting device including: a light emitting element, a phosphor plate, and a light guiding part. The lower face of the light emitting element has a rectangular shape. The light guiding part covers lateral faces of the light emitting element and the lower face of the phosphor plate that is exposed from the light emitting element. The light guiding part has one or more lateral faces having at least one of structures below: a height at both ends being different from the height at a central area; outer lateral faces being parallel to the lateral faces of the light emitting element.

Light emitting device and method of manufacturing same

A light emitting device includes: a light emitting element; a light-transmissive member including a first lower surface, an outer periphery of which being located on an outer side of the light extraction surface in a plan view, an upper surface having a greater area than an area of the first lower surface, a first lateral surface connected to the upper surface, a second lateral surface positioned on an inner side of the first lateral surface and connected to the first lower surface, and a second lower surface connected to the first and second lateral surfaces; a light guiding member covering at least a portion of a lateral surface of the light emitting element and at least a portion of the second lateral surface and the second lower surface; and a covering member covering the first lateral surface and a lateral surface of the light guiding member.

Light emitting device and method of manufacturing light emitting device

A light-emitting device includes a light-emitting element having an upper surface serving as a light-extracting surface, a first light-transmissive member bonded to the upper surface of the light-emitting element and including an inorganic material as a main component and a wavelength conversion member, and a second light-transmissive member bonded to an upper surface of the first light-transmissive member and including an inorganic material as a main component. A periphery of a lower surface of the first light-transmissive member is located outward of a periphery of the upper surface of the light-emitting element in a plan view. A periphery of an upper surface of the second light-transmissive member is located inward of a periphery of the upper surface of the first light-transmissive member in the plan view.

A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess.

A light-emitting device includes a semiconductor light-emitting element, a first resin layer, a first metallic layer, a second resin layer, and a second metallic layer. The semiconductor light-emitting element includes a semiconductor stacked body and an electrode provided on one side of the semiconductor stacked body. The second resin layer is provided on the first resin layer and has a lower surface in contact with the first resin layer and an upper surface opposite to the lower surface. The second metallic layer is provided in the second resin layer and has a metallic lower surface and a metallic upper surface opposite to the metallic lower surface. The metallic upper surface is exposed from the second resin layer. The metallic upper surface of the second metallic layer is at least partially lower in height from the semiconductor stacked body than the upper surface of the second resin layer.

Growing community of inventors

Anan, Japan

Takanobu Sogai