Sharp Kabushiki Kaisha Corporation

Takanobu Matsuo

Masahiro Konishi

Toshio Hata

Masaki Kondo

Kiyohisa Ohta

Takaaki Horio

Masayuki Ohta

Katsuji Iguchi

Keiichi Sawai

Hiroyoshi Higashisaka

Shin Ito

Yutaka Okada

Masumi Maegawa

Tomoshi Kimura

Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Bonding equipment

A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Light-emitting apparatus

A light emitting device includes: a substrate having a main surface; a phosphor layer provided on the main surface and containing an LED element that emits primary light and a fluorescent particle that absorbs a part of the primary light and emits secondary light; and a transparent resin layer having a refractive index n and covering the phosphor layer. The transparent resin layer has an outer circumferential surface that forms a boundary between the transparent resin layer and the atmosphere. When a minimum circumference that includes the overall phosphor layer and is concentric with the outer circumferential surface has a radius r in a cut surface where at least a part of the outer circumferential surface takes a shape of an arc having a radius R, a relationship of R&#x3e;r&#xb7;n is satisfied. With such configuration, the light extraction efficiency is enhanced.

Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

There is provided a light emitting device which makes it possible to reduce optical loss and improve brightness by increasing a ratio of fluorescent light that is not reabsorbed by a light emitting element while decreasing a ratio of scattered light that is reabsorbed by the light emitting element. Individual faces forming outer faces of the light emitting elementare in contact with a bonding memberor sealing member. The bonding memberand the sealing membercontain a fluorophor. Emitted light emitted from the faces of the light emitting elementis transformed into fluorescent light by the fluorophor. Therefore, the ratio of scattered light that is not transformed from the emitted light into the fluorescent light can be decreased while the ratio of fluorescent light is increased.

Light emitting device

Growing community of inventors

Osaka, Japan

Takanobu Matsuo