Canon Kabushiki Kaisha

Takanobu Manabe

Toshiaki Kurosu

Makoto Watanabe

Kenji Fujii

Yoshinori Tagawa

Hiroyuki Murayama

Masataka Nagai

Yusuke Hashimoto

Mitsuru Chida

Shuhei Oya

Satoshi Ibe

Jun Yamamuro

Naoko Tsujiuchi

Yuichiro Akama

Yuji Tamaru

Sayaka Seki

Yasuaki Kitayama

Yukuo Yamaguchi

Kazuhiro Asai

Chiaki Muraoka

Junichiro Iri

Shin Ishimatsu

Hiroto Komiyama

Sayaka Takahashi

Narumi Shinohara

A recording element substrate includes an ejection port forming member in which an ejection port configured to eject liquid is formed, and a substrate. The substrate includes a liquid supply port that supplies the liquid to the ejection port, a first surface on which the ejection port forming member is placed, and a second surface that is a rear surface of the first surface. The liquid supply port includes a first portion perpendicularly connected to the first surface, and a second portion connected to the first portion. An inner wall of the second portion includes an inclined surface that is inclined toward an inner wall of the first portion such that a width of the second portion is gradually increased toward the second surface. A hydrophilic film is formed at least on the inner wall of the first portion.

Recording element substrate and method of manufacturing the same

A liquid ejection head includes a substrate provided with an energy-generating element, an ejection orifice forming member that is formed on the substrate and includes an ejection orifice from which liquid is ejected, a reinforcing rib provided in the ejection orifice forming member, and a recess that is formed in the substrate and forms a part of a flow path of liquid, wherein the reinforcing rib is disposed in the inside of the recess.

Liquid ejection head and method of manufacturing the same

In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.

Liquid ejection head and method of manufacturing liquid ejection head

A liquid ejecting head having high reliability can be manufactured such that the occurrence of cracks in the print element substrate can be suppressed. The supply port of the print element substrate has an opening, the opening width of which at each end portion in the longitudinal direction is narrower than the opening width at the center portion in the longitudinal direction.

Liquid ejecting head and method of manufacturing liquid ejecting head

Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

Method for manufacturing liquid discharge head, liquid discharge head, and method for manufacturing liquid discharge head substrate

Performed are a non-through hole forming step of partitioning a supply path forming region of a second surface into a first region corresponding to a forming position of a beam, a second region located adjacent to the first region on both sides thereof, and a third region that is none of the first region and the second region, and forming a plurality of non-through holes in the second region and the third region, and an etching step of subjecting a silicon substrate to anisotropic etching from the second surface, to thereby form the supply path and the beam in the supply path. In the non-through hole forming step, at least one of an interval or a depth of the non-through holes is caused to differ in the second region and the third region, to thereby control the shape and dimension of the beam to be formed in the etching step.

Method of processing a silicon substrate and method of manufacturing a substrate for a liquid ejection head

A method for manufacturing a liquid discharge head. The method includes a first step of forming a telecentric measurement pattern A by exposure, the telecentric measurement pattern A being part of a measurement pattern that allows determination of inclination of a principal ray caused by an off-axis telecentric degree occurring in a projection exposing device, and a second step of forming a telecentric measurement pattern B by exposure under an exposure condition defocused from an exposure condition in the first step, the telecentric measurement pattern B being another part of the measurement pattern, which allows the determination of the inclination of the principal ray caused by the off-axis telecentric degree occurring in the projection exposing device. The off-axis telecentric degree is determined from an amount of misalignment between relative forming positions of the telecentric measurement patterns A and B and an amount of defocusing.

Method for manufacturing liquid discharge head

A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).

Process for producing a semiconductor chip

A liquid ejection head includes a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice. A sectional area perpendicular to the array direction of the ejection orifices at the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices at both ends of the beam-like projection in the array direction.

Liquid ejection head

A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Method of making nozzle chip

A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, each having one side and another side, the area of an inner wall of the ejection orifices is set to be larger on the other side than on the one side, the one side and the other side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice.

A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Liquid ejection head and method for manufacturing the same

An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Growing community of inventors

Kawasaki, Japan

Takanobu Manabe