Fujifilm Corporation

Takamitsu Tomiga

Fumihiro Yoshino

Toru Fujimori

Shuji Hirano

Tadashi Inaba

Kana Fujii

Kohei Higashi

Shinichi Sugiyama

Kazuyoshi Mizutani

Makoto Kikuchi

Kazutaka Takahashi

Masaru Yoshikawa

Toru Tsuchihashi

Yasunori Yonekuta

Takumi Tanaka

Naoya Hatakeyama

Takahiro Matsuno

Tomoo Kato

Toru Yamada

Jiro Yokoyama

Kenichi Harada

Yuma Kurumisawa

Takashi Bannai

An actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, (P) an amine oxide, and (D) an acid diffusion control agent provided that acid diffusion control agents corresponding to the amine oxide are excluded, in which a content of the amine oxide (P) is from 0.01 ppm to 1,000 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, and a mass ratio of the acid diffusion control agent (D) to the amine oxide (P) is more than 1 and 10,000 or less.

Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device

A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).

Method for producing radiation-sensitive resin composition and pattern forming method

An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (A) having a glass transition temperature of 155&#xb0; C. or higher, a compound (B) having a glass transition temperature of 150&#xb0; C. or lower, and a solvent (C). A solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 20% by mass or more. A softening point of the resist pattern formed using the actinic ray-sensitive or radiation-sensitive resin composition is from 130&#xb0; C. to 170&#xb0; C.

A liquid for polishing a metal is provided that is used for chemically and mechanically polishing a conductor film including copper or a copper alloy in production of a semiconductor device, and a polishing method using the metal-polishing liquid is also provided. The liquid includes: (a) colloidal silica particles having an average primary particle size of from 10 nm to 25 nm and an average secondary particle size of from 50 nm to 70 nm; (b) a metal anticorrosive agent; (c) at least one compound selected from the group consisting of a surfactant and a water-soluble polymer compound; (d) an oxidizing agent; and (e) an organic acid.

Polishing liquid for metal and polishing method using the same

An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method using the composition are provided, the composition including (A) a compound capable of decomposing by the action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a basic compound; and (D) a specific compound containing at least two specific alicyclic hydrocarbon groups each substituted with a hydroxyl group.

Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the same

According to one embodiment, an actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin containing the repeating units of formulae (I), (II) and (III) that when acted on by an acid, becomes soluble in an alkali developer, and (B) a compound that when irradiated with actinic rays or radiation, generates a fluorine-containing acid, wherein each of Rindependently represents a hydrogen atom or an optionally substituted methyl group, Rrepresents a halogen atom, an optionally substituted alkyl group, an optionally substituted cycloalkyl group, an optionally substituted aryl group or an optionally substituted aralkyl group, and n is an integer of 0 to 5, provided that when n is 2 or greater, multiple Rs may be identical to or different from each other.

Actinic ray-sensitive or radiation-sensitive resin composition and method of forming pattern therewith

A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant, wherein, in the formula (I), Rrepresents an alkyl group having 1 to 4 carbon atoms and Rrepresents an alkylene group having 1 to 4 carbon atoms.

Metal-polishing liquid and polishing method

Growing community of inventors

Shizuoka, Japan

Takamitsu Tomiga