Renesas Electronics Corporation

Nec Electronics Corporation

Takamitsu Noda

Tsuyoshi Kida

Yuichi Miyagawa

Jun Tsukano

Hiroyasu Miyamoto

The suppression of resin leakage is combined with the suppression of damage to the functional wiring area of a wiring board in forming an encapsulation resin. A method for manufacturing a semiconductor device includes the step of clamping a wiring board with a first mold and a second mold. The second mold includes: a flat portion contacting a wiring board; a recessed portion forming a cavity to form an encapsulation resin; and a projecting portion formed at a location spaced apart from the recessed portion on the flat portion, the projecting portion projecting on the first mold side, and extending along the first edge of the wiring board.

Method for manufacturing semiconductor device using mold having resin dam and semiconductor device

In a method of manufacturing a semiconductor device, a first groove and a second groove each having a width less than that of a scribe line are formed along the scribe line in a first protective film provided below a second protective film which protects element forming regions when a wafer is divided into parts by a laser dicing, and the first groove and the second groove are filled with the second protective film. Then, the laser dicing is performed on a region between the first groove and the second groove along the scribe line from the surface where the second protective film is formed to form a cutting groove that reaches at least a predetermined depth of the multi-layer interconnect.

Method of manufacturing semiconductor device

A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.

Semiconductor device and method of manufacturing the same

A semiconductor waferhas first scribe linesin two mutually perpendicular directions which have a first width and divide the semiconductor waferinto a plurality of areas; second scribe lineswhich have a second width smaller than the first width and divide the area into a plurality of semiconductor chip areas; an electrode padformed along the edge of the semiconductor chip area; and a metal-containing accessory patterndisposed in the scribe lines. In the second scribe lines, the accessory patternis absent in at least the outermost surface in an area adjacent to the edge having the electrode padin the chip area

Growing community of inventors

Kanagawa, Japan

Takamitsu Noda