Growing community of inventors

Ichihara, Japan

Takamitsu Nakamura

Average Co-Inventor Count = 3.43

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Takamitsu NakamuraKoji Hayashi (3 patents)Takamitsu NakamuraYutaka Satou (2 patents)Takamitsu NakamuraMakoto Kimura (1 patent)Takamitsu NakamuraKunihiro Morinaga (1 patent)Takamitsu NakamuraHajime Watanabe (1 patent)Takamitsu NakamuraYousuke Hirota (1 patent)Takamitsu NakamuraYoshiaki Murata (1 patent)Takamitsu NakamuraTakamitsu Nakamura (4 patents)Koji HayashiKoji Hayashi (20 patents)Yutaka SatouYutaka Satou (27 patents)Makoto KimuraMakoto Kimura (83 patents)Kunihiro MorinagaKunihiro Morinaga (16 patents)Hajime WatanabeHajime Watanabe (10 patents)Yousuke HirotaYousuke Hirota (5 patents)Yoshiaki MurataYoshiaki Murata (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Dic Corporation (4 from 768 patents)


4 patents:

1. 10113028 - Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article

2. 10047190 - Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article

3. 10017604 - Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board

4. 9056990 - Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board

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idiyas.com
as of
12/10/2025
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