Mitsubishi Denki Kabushiki Kaisha

Takamitsu Fujimoto

Toshio Kobayashi

Suguru Nagae

Kazuki Kubo

Kazuko Wakita

Atsuko Noda

Hiroyuki Sato

Keiki Yamada

Fumiaki Baba

Hiroshi Koezuka

Satoshi Yanaura

Takeji Fujiwara

Shuichi Kita

A recording material having a recording layer with microcapsules therein on a support, and a recording method. The microcapsules constituting the recording layer each are composed of a core, a heat-responsive resin layer covering the core, and a shell enveloping the heat-responsive resin layer. The shell is made of a material sensitive to and curable with light having a predetermined wavelength, the core contains a developer (or a dye precursor), and the shell contains a dye precursor (or a developer).

Heat and light-sensitive recording material and recording method with the same

An electrophotographic photosensitive member which comprises an aluminum substrate having an aluminum oxide film at its surface, and, formed sequentially on the substrate, an intermediate layer and a photosensitive layer which contains a photoconductive material, wherein the intermediate layer contains from 5 to 20 wt % of a photoconductive material and has a thickness of from 0.5 to 5 .mu.m, and the resistivity of a laminate of the aluminum oxide film and the intermediate layer is from 10.sup.9 to 3.times.10.sup.10 .OMEGA./3.14 cm.sup.2 when a DC voltage of 20 V is applied.

Electrophotographic photosensitive member

An electrophotographic photosensitive member which comprises an aluminum substrate having an aluminum oxide film at its surface and a photosensitive layer formed on the substrate, which contains a photoconductive material, wherein the aluminum oxide film has a thickness of from 3 to 15 .mu.m, and a resistivity of from 10.sup.9 to 3.times.10.sup.10 .OMEGA./3.14 cm.sup.2 when a DC voltage of 20 V is applied, and an impedance of from 1 to 20 M.OMEGA. at 100 Hz.

An object of the present invention is to provide a photosensitive member having an excellent durability. A sensitizing solution is prepared by adding a polyester resin (resin A) synthesized using an isophthalic acid, neopentyl glycol, phthalic anhydride and adipic acid, other polyester resins, an X-form metal free phthalocyanine as a phthalocyanine type photoconductive compound and a curing agent to a solvent, and is dip-coated on a polyamide layer on an aluminum plate and then dried and cured to give a photosensitive member.

Photosensitive member and method of producing the same

The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.

Moistureproof structure for module circuits

A resin-sealed semiconductor device includes a semiconductor element mounted on a die frame, bonding wires and external wires connected to the bonding wires. The semiconductor element, the bonding wires and portions of the external leads are coated with porous silica gel impregnated with a sealing resin.

Growing community of inventors

Tokyo, Japan

Takamitsu Fujimoto