Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tokyo Electron Saga Limited

Takami Satoh

Noriyuki Anai

Takayuki Tomoeda

Hiroshi Tanaka

Koji Tanaka

Koji Harada

Hirofumi Shiraishi

Shinya Murakami

Sinichiro Izumi

Yuuji Kamikawa

Hideaki Sato

Tsutae Omori

Masafumi Nomura

Tatsuya Iwasaki

Yasuhiro Takaki

Kengo Mizosaki

Shinzi Kitamura

Toshiyuki Shiokawa

Shinichi Umeno

Kouji Harada

Ryoji Ando

Kouichi Tanoue

Yuji Kamikawa

Masato Hayashi

Hideyuki Takamori

Hiroshi Komiya

Kazuyoshi Eshima

Kazuki Kosai

Hiromi Hara

Hideo Shite

Ikuo Sunaka

Hirotaka Maruyama

Ryouichirou Naitou

Takahiro Furukawa

Takashi Uno

Hiroyuki Masutomi

Yasuo Kiyohara

Takahiro Kawazu

Atsushi Anamoto

Kazuyoshi Mizumoto

Kentaro Yoshihara

Hiroyuki Ide

Seiya Totsuka

Tomiyasu Maezono

Michitaka Amiya

Hidetomo Uemukai

Kenji Ichinomiya

Toshiyuki Kawano

Tetsurou Iriyama

Yosuke Kameda

Atsumu Maita

Hirofumi Araki

Akihiro Nakamura

Yusuke Futamata

A solution supply apparatus is for supplying a treatment solution to a treatment solution discharger which discharges the treatment solution to a treatment object. The solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line which filters the treatment solution to remove foreign substances; and a controller. The controller performs a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, outputs a control signal for restricting supply of the treatment solution to the primary side of the filter.

Solution supply apparatus and solution supply method

A liquid processing apparatus includes a processing unit, a first supply route, a first device, a second supply route, a second device, a housing, and an external housing. The processing unit processes a substrate by using processing liquid including first and second processing liquids. The first supply route is for supplying the first processing liquid to the processing unit. The first device is for supplying the first processing liquid to the first supply route. The second supply route is for supplying the second processing liquid to the processing unit. The second processing liquid has higher temperature than the first processing liquid. The second device is for supplying the second processing liquid to the second supply route. The housing accommodates the processing unit. The external housing accommodates the first and second devices, and is adjacent to the housing. The external housing includes a partition wall between the first and second devices.

Liquid processing apparatus

A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.

Substrate liquid processing apparatus

The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates.

Substrate liquid processing apparatus, substrate liquid processing method, and storage medium

A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.

Flow-rate regulator device, diluted chemical-liquid supply device, liquid processing apparatus and its operating system

A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.

Substrate processing apparatus and liquid mixing method

Provided is an etching method including: an etching step of performing an etching processing using an etching liquid on a workpiece accommodated in an etching processing unit; and an interval step between the etching step on the workpiece and a next etching step on another workpiece. The etching step includes a first partial replacement pattern including discharging the etching liquid in the etching processing unit provided for the etching processing by a first set amount, and supplying a new etching liquid into the etching processing unit by a second set amount, and the interval step includes a second partial replacement pattern including discharging the etching liquid in the etching processing unit provided for the etching processing by a third set amount, and supplying a new etching liquid into the etching processing unit by a fourth set amount.

Etching method, etching apparatus, and storage medium

Disclosed is a substrate liquid processing apparatus including a processing liquid storage unit that stores a processing liquid; a processing liquid supply unit that supplies the processing liquid to the processing liquid storage unit; a processing liquid circulation unit that circulates the processing liquid inside the processing liquid storage unit; a processing liquid discharge unit that discharges the processing liquid; a concentration sensor that measures a concentration in the processing liquid; and a controller that controls the processing liquid supply unit. The controller controls the processing liquid circulation unit to circulate the processing liquid, the processing liquid discharge unit to discharge the circulated processing liquid intermittently at a predetermined timing or continuously for a predetermined period of time, the processing liquid supply unit to newly supply the processing liquid, and the concentration sensor to measure the concentration in the processing liquid at a predetermined timing.

Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium

An apparatus is configured to perform a solution process by supplying a processing solution from a processing solution supply source to the substrate held on a substrate holder via a flow path member and a nozzle at a flow rate equal to or less than 1 mL/sec. The apparatus includes a solution transfer unit configured to transfer the processing solution to the nozzle, and connected to the flow path member, and an ultrasonic flowmeter connected to the flow path member at an outlet side from the solution transfer unit. In this embodiment, a lower limit of a flow rate range which is measured by the ultrasonic flowmeter is equal to or less than 1 mL/sec.

Solution processing apparatus, solution processing method, and non-transitory computer-readable recording medium

According to an embodiment of the present disclosure, an apparatus is configured to perform a solution process by supplying a processing solution from a processing solution supply source to the substrate held on a substrate holder via a flow path member and a nozzle at a flow rate equal to or less than 1 mL/sec. The apparatus includes a solution transfer unit configured to transfer the processing solution to the nozzle, and mounted to the flow path member, and an ultrasonic flowmeter mounted to the flow path member at a downstream side from the solution transfer unit. In this embodiment, a lower limit of a flow rate range which is measured by the ultrasonic flowmeter is equal to or less than 1 mL/sec.

A plug-in unit includes a breaker electrically connected with a busbar at a power supply side and an electric device electrically connected with the breaker. Joint surfaces making contact with each other are formed at the breaker and the electric device, respectively. The breaker includes a terminal metal fitting connecting the busbar thereto and a plug-in terminal metal fitting installed at the joint surface of the breaker, and the electric device includes a plug terminal, which is installed at the joint surface thereof and capable of being connected with the plug-in terminal metal fitting. The breaker is detachably joined with the electric device by an engaging member including an engaging unit and an engagement receiving unit. The engaging unit and the engagement receiving unit are installed at the joint surfaces of the breaker and the electric device, respectively, and detachably engaged with each other.

Plug-in unit including a breaker and an electric device

Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Washing apparatus, and washing method

A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.

Method for washing objects

An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

Hydrophobic treatment method involving delivery of a liquid process

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Kumamoto, Japan

Takami Satoh