Fujitsu Corporation

Takamasa Shinde

Tetsuyuki Kubota

Kazuhisa Inagaki

Akira Sakai

Akira Ueda

Hidehisa Sakai

Makoto Sakairi

Akihiko Fujisaki

Hideharu Matsushita

Akihiro Otsuka

Yasuhiro Ite

Sachiko Furuya

A temperature calculation method for a substrate, the temperature calculation method includes: calculating, by a computer performing a circuit simulation based on a resistance equivalent to a component that joins two substrates included in a target model of an analysis, a value of a current that flows through the component or voltage values in respective end portions of the component; setting, based on model information for expressing the target model, the current value or the voltage values in a first surface and a second surface that are included in surfaces of an outer shape of the component and that are in contact with the respective substrates; and calculating a first current density distribution of the component by performing a first electrical analysis according to the setting.

Temperature calculation method, information processing device, and non-transitory recording medium storing temperature calculation program

A disclosed setting method includes: in response to an instruction to replace a first component with a second component, determining whether or not data that correlates a surface of the first component with a surface of a third component has been set; upon determining that the data that correlates the surface of the first component with the surface of the third component has been set, extracting a surface of the second component, which corresponds to the surface of the first component; and correlating the extracted surface of the second component with the surface of the third component instead of the surface of the first component in the data.

Setting method and information processing apparatus

Growing community of inventors

Kawasaki, Japan

Takamasa Shinde