Kabushiki Kaisha Toyota Jidoshokki

Takamasa Nodo

Satoshi Ito

Kazuhiro Maeno

Haruo Takagi

Kunikazu Sato

A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

Surface mounting structure for a surface mounting electronic component

A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

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Kariya, Japan

Takamasa Nodo