Omron Corporation

Takamasa Kameda

Yusuke Nakayama

Tsuyoshi Miyata

Daisuke Inoue

Motoharu Okuno

Yuki Ushiro

Kazuyoshi Nishikawa

Kazunari Komai

Takaaki Sanda

Makoto Sugimoto

Hiroshi Tasaki

Susumu Mizuhara

Koyo Ozaki

Takashi Muramatsu

Shuhei Ojiro

Makoto Kasuya

Tetsu Shimizu

Tomonari Imabayashi

Yuki Marumoto

Takuya Honjo

Yukitaka Kishimoto

Koichi Hirao

Mikio Hiratsuka

Takashi Yuri

Eiichi Miyake

Sensor

A light projector has a light emitting device having a light emitting surface, an optical fiber having an incident end-face to which light emitted from the light emitting surface enters, and a lens arranged between the light emitting surface of the light emitting device and the incident end-face of the optical fiber. The light emitting device, the optical fiber and the lens are arranged on one optical axis. The optical fiber includes a core region as a region including a single core of uniform refractive index or a region collectively encompassing a plurality of cores having uniform refractive index. The lens converts diffused light emitted from the light emitting surface to diffused light that widens more moderately.

Light projector and sensor

A first light-blocking member and a second light-blocking member are adhered to each other by forming a light-transmitting layer having a light-transmitting composition serving as a base material and a light-transmitting filler different in index of refraction from this light-transmitting composition on a front surface of the first light-blocking member. A liquid light curing adhesive is applied to a front surface of the light-transmitting layer. The second light-blocking member is arranged on the front surface of the light-transmitting layer to which the liquid light curing adhesive has been applied. The liquid light curing adhesive is cured by irradiating the light-transmitting layer with light having a prescribed wavelength laterally from a side of the light-transmitting layer so as to adhere the light-transmitting layer and the second light-blocking member to each other. By adhering light-blocking members to each other, an adhesion operation may easily and quickly be performed with sufficient adhesion strength.

Adhesion structure of light-transmitting member and light-blocking members, method of manufacturing optical module including light-transmitting member and light-blocking members, and optical module

A semiconductor package for surface mounting has a substrate having electrode patterns formed on both its surfaces which are electrically connected through passages such as throughholes formed through the substrate, all of these electrode patterns having a metal film formed by an electrolytic plating process. Semiconductor chips are wire-bonded onto one its surfaces (mounting surface) which is sealed with a resin layer. Lead-in wires each with one end exposed externally are included only those of the electrode patterns on the back surface of the substrate opposite its mounting surface such that the mounting surface has no lead-in wires with a part exposed externally.

Semiconductor packages for surface mounting and method of producing same

Growing community of inventors

Fukuchiyama, Japan

Takamasa Kameda