Canon Kabushiki Kaisha

Takamasa Ishii

Minoru Watanabe

Chiori Mochizuki

Masakazu Morishita

Keiichi Nomura

Masato Inoue

Kota Nishibe

Shinichi Takeda

Satoru Sawada

Taiki Takei

Osamu Tsujii

Kentaro Fujiyoshi

Jun Kawanabe

Masayoshi Akiyama

Tomohiro Hoshina

Tatsuya Yamazaki

Masato Ofuji

Hiroshi Wayama

Toshikazu Tamura

Hideki Nonaka

Akira Hirai

Toshiko Morii

Katsuro Takenaka

Isao Kobayashi

Shoshiro Saruta

Yoshito Sasaki

Masao Ina

Shinji Ono

Satoshi Okada

Kosuke Terui

Yohei Ishida

Tomoaki Ichimura

Masayoshi Tokumoto

Keiichi Momura

A method of operating a radiation imaging apparatus including a sensor substrate which includes a plurality of pixels arranged in a matrix, each pixel including a conversion element configured to convert radiation or light into an electric charge and accumulate the electric charge and a switch element. The method includes, supplying a first driving potential to set the switch element in a non-conductive state, changing a bias potential supplied to a second terminal of the conversion element to remain a charge in the conversion element, supplying a second driving potential to the switch element to readout a remaining charge, and calculating a threshold voltage of the switch element based on the remaining charge.

Operation method of radiation imaging apparatus having sensor substrate and bias power supply, radiation imaging apparatus, and computer-readable medium

A sensor board comprising a substrate comprising a pixel region where pixels are arranged on a first surface of two surfaces, a scintillator arranged on one of the first surface and a second surface of the two surfaces and a light shielding member arranged on the surface on which the scintillator is arranged, is provided. The pixel region comprises a first region where a signal for radiation image is generated and a second region where a signal for correcting a signal output from the first region is generated. The scintillator is arranged to overlap the first region but not to overlap the second region. The light shielding member is arranged to cover the scintillator and overlap the second region. A portion of the light shielding member overlapping the second region is bonded to the surface on which the scintillator is arranged.

Sensor board, radiation imaging apparatus, radiation imaging system, and method of manufacturing sensor board

A method of manufacturing a radiation imaging apparatus includes electrically connecting a first surface of a flexible insulating layer to a conductive portion of a circuit substrate, covering an exposed portion of the conductive portion with a protection layer, and separating the flexible insulating layer from a substrate in contact with a second surface of the flexible insulating layer. The circuit substrate includes an integrated circuit mounted on the circuit substrate. The flexible insulating layer includes, on the first surface, a plurality of pixels arranged in a two-dimensional matrix to convert radiation into an electrical signal. The second surface of the flexible insulating layer is opposite to the first surface of the flexible insulating layer. The flexible insulating layer is separated from the substrate by irradiating the second surface with light transmitting through the substrate.

Radiation imaging apparatus and manufacturing method of same

A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

Radiation imaging apparatus comprising a first scintillator plate, a second scintillator plate, and an imaging portion, and radiation imaging system

A scintillator panel including a scintillator layer that converts incident radiation into light and a scintillator base that supports the scintillator layer, a sensor panel including a sensor substrate that is disposed on a side of the scintillator layer that is opposite to the scintillator base and has a photoelectric conversion portion that converts the light into an electric signal, and a sensor base that is disposed on the side of the sensor substrate that is opposite to the scintillator layer and supports the sensor substrate, and a sealing member that seals a gap between the scintillator panel and the sensor panel at an edge of the scintillator panel are comprised. The sensor panel is provided with a convex member for narrowing the gap at a position in a vertical direction to a surface of the sensor panel from the edge of the scintillator panel.

Radiation imaging apparatus and radiation imaging system

A radiation detecting device in which defective adhesion between an adhesive member and end portions of a plurality of sensor substrates is reduced. A radiation detecting device includes a plurality of sensor substrates disposed adjacent to each other, each sensor substrate including a side surface that connects a first surface, where a plurality of photoelectric converting elements are arranged in an array, and an opposing second surface to each other; a scintillator disposed at a side of the first surfaces of the plurality of sensor substrates; and a sheet-like adhesive member for adhering the plurality of sensor substrates and the scintillator to each other, wherein, between the plurality of sensor substrates, the sheet-like adhesive member adheres to the first surfaces and at least portions of the side surfaces such that the sheet-like adhesive member extends and continuously adheres from the first surfaces to the at least portions of the side surfaces.

Radiation detecting device, radiation detecting system, and method for manufacturing the radiation detecting device

A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.

Radiation imaging apparatus, manufacturing method thereof, and radiation imaging system

Provided is a radiographic imaging apparatus that is high in sharpness of a picked up image and excellent in DQE by improving the amount of light that enters a photoelectric conversion element, despite a scintillator layer being formed thick. The radiographic imaging apparatus includes: the photoelectric conversion element; and a wavelength converting layer which has a bottom surface located above the photoelectric conversion element and a top surface for receiving an incident radiation ray, and which contains a scintillator layer. The wavelength converting layer has light transmitting properties in at least a region positioned to be above the photoelectric conversion element, and contains the scintillator layer at a density that is lower on the bottom surface side than on the top surface side in the thickness direction of the region.

Radiographic imaging apparatus and imaging system

A radiation detection apparatus includes a plurality of detection substrates on which photoelectrical conversion elements are arranged, a plate configured to support the plurality of detection substrates, a scintillator, and a plurality of bonding material members configured to bond the plurality of detection substrates and the scintillator. The plurality of bonding material members bond one-side surfaces of the plurality of detection substrates and a one-side surface of the scintillator, and the plurality of bonding material members are separated from each other and arranged so that outer edges of the plurality of bonding material members are not positioned between the plurality of detection substrates.

Radiation detection apparatus, radiation imaging system, and method of manufacturing radiation detection apparatus

A radiation imaging apparatus for sensing a radiation image, includes a radiation imaging panel including a plurality of imaging substrates and a scintillator having a first face and a second face which oppose each other, a housing configured to house the radiation imaging panel and including a first plate-shaped portion and a second plate-shaped portion, a first support member located between the first face of the scintillator and the first plate-shaped portion of the housing so as to support the scintillator via the plurality of imaging substrates, and a second support member located between the second face of the scintillator and the second plate-shaped portion of the housing so as to support the scintillator.

A radiation image pickup apparatus includes an image pickup panel in which a plurality of image pickup substrates including photoelectric-conversion elements is fixed onto a base, a scintillator portion including a scintillator layer of alkali halide-based columnar crystal and overlaid on the image pickup panel, and a moisture-proof layer provided between the base and the scintillator layer, at least between the plurality of image pickup substrates. The water vapor permeability of the moisture-proof layer is 10 g/m/day or less.

Radiation image pickup apparatus, and radiation image pickup system

A radiation detecting apparatus includes a scintillator and a photoelectric conversion panel. The photoelectric conversion panel includes a frame member disposed on an outer side of a photoelectric conversion section along at least a portion of one side of the photoelectric conversion panel. The frame member includes an inclined surface having a downward slope toward the photoelectric conversion section. The scintillator includes a first scintillator formed continuously on the inclined surface of the frame member and a surface of the photoelectric conversion section, and a second scintillator formed on the first scintillator. The first scintillator has a non-columnar crystal structure, and the second scintillator has a columnar crystal structure.

Radiation detecting apparatus and radiation detecting system

A radiation detection apparatus, comprising a housing including a first plate portion and a second plate portion arranged to face each other, a scintillator configured to convert radiation into light, supported by a supporting portion arranged in a side of the second plate portion in the housing, a sensor panel including a sensor array in which a plurality of sensors for detecting light are arrayed, interposed between the scintillator and the first plate portion in the housing, and a member interposed between the first plate portion and the sensor panel in the housing, wherein the sensor panel is arranged to position an outer edge of the sensor panel outside an outer edge of the scintillator, and the member is arranged to position an outer edge of the member inside the outer edge of the scintillator.

Radiation detection apparatus and imaging system

A radiation imaging apparatus comprising a plurality of sensor units each including a plurality of photoelectric converters, a substrate configured to support the plurality of sensor units, and a scintillator, wherein the scintillator comprises scintillator grains configured to convert radiation into light and a binder configured to make the scintillator grains adhere to each other, and the scintillator includes first portions provided between the plurality of sensor units and a second portion provided on the plurality of sensor units and the substrate.

An electric device, comprising a conductive guard ring formed on a substrate along an outer periphery of the substrate, an electrode formed inside the guard ring on the substrate, and a connecting portion formed above the electrode, for connecting an external apparatus and the electrode, wherein the connecting portion includes a conductive member for electrically connecting the external apparatus and the electrode, and an insulating member formed on a lower surface of the conductive member, and the insulating member exposes a portion of the conductive member, which is positioned immediately above the electrode, and an end of the insulating member is positioned inside the guard ring in planar view such that the conductive member and the guard ring do not contact each other.

Growing community of inventors

Honjo, Japan

Takamasa Ishii