Murata Manufacturing Co., Ltd.

Takako Sato

Osamu Chikagawa

Tomoya Yokoyama

Akiyoshi Kawamura

Takaki Murata

Shigetoshi Hayashi

Koji Furutani

Hirokazu Yazaki

Tetsuro Harada

Masanori Okamoto

Takeshi Osuga

Hiroki Maegawa

Akihiro Ieda

A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture ratio of the openings in an outer peripheral portion of the ground conductor is less than an aperture ratio of the openings in an inner peripheral portion of the ground conductor.

Multilayer resin substrate and electronic component

A multilayer substrate includes a stacked body including a plurality of insulating base material layers stacked on each other and a plurality of conductor patterns provided in contact with the plurality of insulating base material layers. The stacked body includes a first surface, and the plurality of conductor patterns include a plurality of mounting electrodes. The plurality of mounting electrodes include first openings. The first openings, in a plan view of a mounting surface, are provided over a mounting region and a non-mounting region of the mounting electrodes. The mounting region, when a mounted component is mounted, overlaps with the mounted component, and the non-mounting region does not overlap with the mounted component.

Multilayer substrate and electric element

A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface of the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer is located at a level different from a level of an interface between the first conductive wiring layer and the first insulating layer.

Multilayer wiring board

A multilayer bodyincludes nonmagnetic sheets SHand SHeach having an upper surface provided with a plurality of linear conductors, a magnetic sheet SHhaving an upper surface provided with a plurality of linear conductors, and a nonmagnetic sheet SHhaving an upper surface provided with a plurality of linear conductors, which are stacked one on top of another. Via-hole conductors or side-surface conductors are disposed with the multilayer bodyso as to connect these linear conductors to one another and form an inductor. The plurality of linear conductors have a pattern that is common among at least two sheets adjacent to each other in a stacking direction.

Inductor element

Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.

Multilayer substrate

A laminated inductor element is configured to prevent warpage of the entire element with a structure in which a non-magnetic ferrite layer on an upper surface side is reduced in thickness to achieve a reduction in height of the entire element, a non-magnetic ferrite layer on a lower surface side is increased in thickness to be thicker than the non-magnetic ferrite layer so as to prevent a metal component diffused from a magnetic ferrite layer from coming into electrical contact with a land electrode of a mounting substrate, and an inductor is disposed toward the lower surface side across a non-magnetic ferrite layer.

Laminated inductor element and manufacturing method thereof

In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.

A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The base including the electrode disposed thereon is prepared and a surface of the electrode is smoothed by vibrating media such that the media are arranged to be in contact with the electrode.

Method for smoothing a surface of an electrode

When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.

Method for manufacturing ceramic substrate and ceramic substrate

A high-frequency module includes a switching circuit having a phase-shift circuit. The phase-shift circuit matches only PCS/DCS reception signals so as to be passed therethrough by setting a control-voltage input terminal to a Low level when receiving PCS/DCS signals, and attenuates PCS/DCS transmission signals to the PCS/DCS reception circuit side by setting the control-voltage input terminal to a Hi level when transmitting PCS/DCS signals. Also, another phase-shift circuit, which further attenuates the PCS transmission signal when transmitting the PCS signal, is provided in the DCS Rx terminal side of the phase-shift circuit.

Growing community of inventors

Nagaokakyo, Japan

Takako Sato