Omron Corporation

Takako Onishi

Shinji Sugita

Atsushi Shimizu

Hiroyuki Mori

Hirotaka Wada

Akira Nakajima

Toshihiro Moriya

Katsuki Nakajima

Mayuko Tanaka

Isao Nakanishi

Hironori Kasahara

Yoshihide Ota

Yuji Umemoto

An inspection management system having a plurality of processes and managing final inspection performed to inspect a completed product and one or more intermediate inspections performed to inspect an intermediate product manufactured in the processes earlier than a final process includes: an inspection content data acquisition unit that acquires inspection content data including an inspection standard for each inspection item of the product; an inspection content setting unit that sets inspection content based on the inspection content data acquired by the inspection content data acquisition unit; a simulation unit that simulates inspection in accordance with assumed inspection content; an inspection standard calculation unit that calculates an inspection standard more appropriate than a current inspection standard based on the simulation; and an output unit that outputs base information indicating that at least the inspection standard calculated by the inspection standard calculation unit is more appropriate than the current inspection standard.

Inspection management system, inspection management apparatuses, and inspection management method

An inspection management system that manages inspection of an inspection apparatus in a production line including a manufacturing apparatus of a product and the inspection apparatus includes: an acquisition unit configured to acquire inspection content data including an inspection standard for each component; an inspection content setting unit configured to set inspection content; a setting-related information acquisition unit configured to acquire setting-related information including at least a time at which new inspection content is set when the inspection content setting unit sets the new inspection content; a storage unit configured to retain the setting-related information in association with a history of the setting of the inspection content; a setting-related information reading unit configured to read the setting-related information retained in the storage unit; and an output unit configured to be able to output the setting-related information.

An X-ray inspection apparatus includes a stage that moves an inspection object, an X-ray source, and/or an X-ray camera by driving a motor, a position detection unit that periodically obtains a position detection value of the motor, and stores the value in association with time, an imaging timing obtaining unit that stores an imaging timing at which imaging is performed by the X-ray camera in association with time, an imaging position calculation unit that calculates relative positions of the inspection object, and the X-ray source and the X-ray camera corresponding to the imaging timing using the position detection value of the motor at the imaging timing, and a reconstruction unit that performs reconstruction using image data captured by the X-ray camera and the relative positions in the image data at the imaging timing.

X-ray inspection apparatus and X-ray inspection method

An inspection apparatus includes a feed-in preparation chamber, an imaging chamber, and a feed-out preparation chamber. Each preparation chamber includes a feed-in unit that receives an inspection object through a first opening, a traverser that translates the received object to a second opening in a direction different from the receiving direction of the object, and a feed-out unit that moves the object in a direction different from a moving direction of the traverser and discharges the object through the second opening. The imaging chamber includes an imaging unit that images the object fed from the feed-in preparation chamber. The traverser includes a mount for the object, and a shield that moves together with the mount and prevents radioactive rays entering one of the first and second openings and propagating in the moving direction of the traverser from reaching the other opening.

Inspection apparatus

An X-ray inspection apparatus includes a 3D processing unit that performs 3D imaging of a first area in an inspection area, a 2D processing unit that performs 2D imaging of a second area in the inspection area, an extraction unit that extracts 3D information for a first inspection target from a 3D image of the first area, and 2D information for a second inspection target from a 2D image of the second area, a 3D information estimation unit that estimates 3D information for the second inspection target using the extracted 3D information for the first inspection target, and an inspection unit that inspects the second inspection target using the 2D information for the second inspection target and the estimated 3D information for the second inspection target.

X-ray inspection apparatus and control method

For each teaching image, a plurality of patterns of color pickup regions each include a first region for picking up a color of a first part and a second region for picking up a color of a second part are set, the color of each pixel in the first region and the color of each pixel in the second region are mapped as a target point and an exclusion point respectively, to a color space for each of the patterns of the color pickup regions, a degree in separation between a target point distribution and an exclusion point distribution in the color space is calculated for each of the patterns of the color pickup regions, a pattern of a color pickup region having a maximum degree in separation is selected, a color range which divides the color space and has the largest difference between the number of target points and the number of exclusion points in the selected pattern therein is found, and the found color range is set as a color condition used in a board inspecting process.

Board inspecting apparatus, its parameter setting method and parameter setting apparatus

A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge of the body of the component to be inspected is captured. By using the color condition, a component body area satisfying the color condition is extracted from the inspection image by an image process.

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Kyotanabe, Japan

Takako Onishi