Denka Company Limited

Denki Kagaku Kogyo Kabushiki Kaisha

Takako Hoshino

Yoshitsugu Goto

Hiroyuki Kurimura

Gosuke Nakajima

Yoshiyuki Kobayashi

Kimihiko Yoda

Yuki Hisha

Isamu Ichikawa

Makiko Sasaki

Masaya Umeyama

Yukihiko Yamashita

Takayuki Nagumo

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt. 

Adhesive composition

A composition having excellent adhesiveness to poorly adhesive materials such as polyolefins is provided. The solution is a composition comprising the following (1) to (2): (1) (meth)acrylates containing the following (1-1) to (1-3): (1-1) a (meth)acrylate having a hydroxyl group, (1-2) an alkyl (meth)acrylate, and (1-3) a (meth)acrylate having a cyclic ether skeleton, and (2) an organoboron compound. The content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):(1-3)=(10 to 90):(5 to 80):(5 to 80) in mass ratio in 100 parts by mass of (1) (meth)acrylates.

Composition having excellent adhesiveness to polyolefins

A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Resin composition

Provided is a resin composition comprising (A) an epoxy compound, (B) an epoxy resin, and (C) a photocationic polymerization initiator. Preferably, this resin composition has a moisture content of 1000 ppm or less and a chlorine content of 1000 ppm or less. This resin composition is an energy beam-curable resin composition having accurate coating properties, excellent adhesiveness, low moisture permeability, excellent adhesive durability, and excellent storage stability.

Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250&#xb0; C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30&#xb0; C. to 250&#xb0; C. at a temperature increase rate of 10&#xb0; C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250&#xb0; C. or higher.

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Shibukawa, Japan

Takako Hoshino