Hitachi Chemical Company, Ltd.

Takako Ejiri

Katsuyuki Masuda

Shin Takanezawa

Nobuyuki Ogawa

Kenji Takai

Masaki Takeuchi

Norio Moriike

Toshihisa Kumakura

Kenichi Tomioka

Takahiro Tanabe

Hitoshi Onozeki

A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2). 

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

A process for production of a polyamide resin having a reactive double bond, the process including a step of reacting a carboxylic acid and a diisocyanate to produce a polyamide resin, wherein the carboxylic acid component includes a carboxylic acid with a reactive double bond. Also, a polyamideimide resin obtainable by reacting a diisocyanate with a diimidedicarboxylic acid and a reactive double bond-containing carboxylic acid, which has a reactive double bond.

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

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Chikusei, Japan

Takako Ejiri