Murata Manufacturing Co., Ltd.

Takaki Murata

Hirotsugu Mori

Kengo Onaka

Yasutaka Sugimoto

Osamu Chikagawa

Takako Sato

Akiyoshi Kawamura

Kaoru Sudo

Hideki Ueda

Satoshi Ohga

A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.

Antenna module

An antenna module () includes at least one antenna element (), a ground electrode (GND), and a dielectric layer (), which is provided between the antenna element () and the ground electrode (GND), and on which the antenna element () is mounted. A space () is formed between the dielectric layer () and the ground electrode (GND) in a region where the antenna element () and the ground electrode (GND) overlap each other when the dielectric layer () is seen in a plan view.

Antenna module and communication device equipped with the same

An antenna module () includes an antenna element (), a dielectric substrate () on which the antenna element () is arranged, and a flexible substrate () having a first surface and a second surface. The flexible substrate () has a first portion (), a bent portion () bent from the first portion () such that the first surface is located in an outer side portion, and a flat second portion () extending further from the bent portion (). The dielectric substrate () is arranged on the first surface of the second portion (). The dielectric substrate () has a projection portion () projecting from a contact surface between the dielectric substrate () and the flexible substrate () toward a side of the first portion () along the second portion (). At least part of the antenna element () is arranged on the projection portion ().

Antenna module and communication device equipped with same

A ceramic material composition advantageously used as a material for a ceramic substrate containing for example a resistor such as an isolator disposed therein. includes about 10 to 45 percent by weight of a BaO&#x2014;TiO&#x2014;ReOceramic composition, the ceramic composition being represented by xBaO-yTiO-zReO(wherein x, y, and z each represent mole percent, 8&#x2266;x&#x2266;18, 52.5&#x2266;y&#x2266;65, and 20&#x2266;z&#x2266;40, and x+y+z=100; and Re represents a rare-earth element); about 5 to 40 percent by weight of alumina; and about 40 to 65 percent by weight of a borosilicate glass composition containing about 4 to 17.5 percent by weight of BO, about 28 to 50 percent by weight of SiO, 0 to about 20 percent by weight of AlO, and about 36 to 50 percent by weight of MO (wherein MO represents at least one compound selected from CaO, MgO, SrO and BaO), wherein the total content of the BaO&#x2014;TiO&#x2014;ReOceramic composition and alumina is about 35 percent by weight or more.

Ceramic material composition, ceramic substrate, and nonreciprocal circuit device

When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.

Method for manufacturing ceramic substrate and ceramic substrate

A method for producing a ceramic compact includes a laminate-preparing step of preparing an unfired laminate including a base layer including a ceramic powder and a glass material and a constraining layer that is in contact with at least one principal surface of the base layer and that primarily includes a burnable material which does not burn off when the burnable material is fired in a low-oxygen atmosphere but which burns off when the burnable material is fired at an oxygen partial pressure greater than that of the low-oxygen atmosphere, and a firing step of firing the unfired laminate to sinter the base layer. The firing step includes a first firing sub-step of firing the laminate including the constraining layer to sinter the base layer and a second firing sub-step of firing at an oxygen partial pressure greater than that of the first firing sub-step such that the burnable material included in the constraining layer burns off.

Method for producing ceramic compact

A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed. With a multilayer ceramic board, protruding portions are formed along at least a portion of the outer circumference of a principal surface.

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Kusatsu, Japan

Takaki Murata