Nissan Chemical Industries Limited

Takakazu Nakada

Hiroyoshi Fukuro

Hitoshi Furusho

Kenichi Motoyama

Tatsuya Nogami

Rie Sakai

Takeshi Hosoya

Makoto Wakabayashi

Rie Gunji

A silica-based coating film on a substrate surface is prepared by forming a reaction mixture comprising a tetraalkoxysilicon compound (A) and/or an alkyl/alkoxy silane compound (B), an alcohol (C), and oxalic acid (D), in such ratios that the amount of alcohol (C) ranges from 0.5 to 100 mols per mol of all alkoxy groups present in the silicon compounds (A) and (B), and the amount of oxalic acid (D) ranges from 0.2 to 2 mols per mol of all alkoxy groups in the silicon compounds (A) and (B), and while maintaining the mixture at a SiOconcentration ranging from 0.5 to 11%, as calculated from silicon atoms in the mixture, by means of the alcohol (C); heating the reaction mixture at a temperature ranging from 50 to 180&#xb0; C. until the total remaining amount of the silicon compounds (A) and (B) in the reaction mixture is not more than 5 mol %, to form a solution of a polysiloxane having a number average molecular weight, calculated on the basis of a polystyrene standard, ranging from 2,000 to 15,000; applying a coating fluid containing the solution of the polysiloxane onto a substrate surface; and thermally curing a coating film obtained by the application, at a temperature ranging from 80 to 600&#xb0; C.

Method of forming thick silica-based film

The present invention provides a process for forming a silica-based coating film, characterized by heating a reaction mixture comprising a silicon compound (A) represented by Si (OR)and/or a silicon compound (B) represented by RSi (OR)(wherein n is an integer of from 1 to 3), an alcohol (C) represented by RCHOH and oxalic acid (D) in specific ratios, at a temperature of from 50 to 180&#xb0; C. in the absence of water, to form a solution of a polysiloxane having a number average molecular weight, as calculated as polystyrene, of from 2,000 to 15,000, applying a coating fluid containing such a solution on a substrate surface, and thermally curing a coating film obtained by such coating, at a temperature of from 80 to 600&#xb0; C., and such a coating film having a film thickness of from 0.5 to 5 &#x3bc;m, a coating fluid to be used for such a coating film, and a process for producing such a coating fluid.

The present invention relates to an antireflection film effective for improving the transparency of an image display device such as a liquid crystal display (LCD), a plasma display (PDP), CRT, EL or a touch panel, to an optical product made of glass, such as a lens for eye glasses, and to an antireflection glass. The present invention is also directed to a process of coating a glass surface with a mixture comprising particular silicon compounds and thermosetting the coating film at a temperature ranging from 480 to 520&deg; C. This process can be used to form an antireflection film on a glass surface having a refractive index ranging from 1.33 to 1.38 and a contact angle of water of at most 40 degrees.

Antireflection film, process for forming the antireflection film, and antireflection glass

A coating film having a refractive index of from 1.28 to 1.38 and a contact angle of water of from 90.degree. to 115.degree., adhered on a substrate surface, and prepared by reacting a particular tetraalkylsilicate, a particular fluorine-containing silicon compound, a particular hydroxy-containing compound, and oxalic acid in a particular range of ratios and in the absence of water, and under further specified reaction conditions.

Coating film having water repellency and low refractive index

A process for forming a liquid crystal vertical alignment film on an electrode substrate surface, which comprises preparing a reaction mixture comprising a silicon compound (A) of the following formula (1):

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Tokyo, Japan

Takakazu Nakada