Dow Toray Co., Ltd.

Dow Tray Co., Ltd.

Takakazu Hino

Michitaka Suto

Akihiro Nakamura

Tomohiro Iimura

Hidefumi Tanaka

Haruhiko Furukawa

This disclosure relates to a curable silicone composition that contains little to no solvent, has excellent transparency and adhesion to a substrate, and has a low overall haze value, and also relates to a cured product thereof. The curable silicone composition comprises: 100 mass parts of (A) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and a degree of siloxane polymerization (DP) within a range of 10 to 1000; 1 to 100 mass parts of (B) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and having a DP within a range of 1001 to 10,000; 0 to 100 mass parts of (C) an organopolysiloxane resin; (D) a polyorganohydrogen siloxane; and (E) a catalytic amount of a hydrosilylation reaction catalyst. Optionally, the composition further comprises: 0 to 60 mass parts of (F) an organic solvent, for 100 mass parts of the sum of components (A) to (D).

Curable silicone composition and cured product of same

A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.

Method for producing silicone-based adhesive

Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25&#xb0; C.) specified in JIS K 6251, and 1.8&#xd7;10to 4.5&#xd7;10Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25&#xb0; C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

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Ichihara, Japan

Takakazu Hino