Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Takakazu Fukumoto

Muneharu Tokunaga

Tetsuya Matsuura

Hajime Maeda

Tetsuya Takeoka

A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.

Stacked semiconductor device structure

A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.

Clip-type lead frame for electrically connecting two substrates or devices

Semiconductor device

A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board. The mother board has connection terminals having an ability of connecting with first and second generation type unit boards, so that even when a connection terminal location is changed as a result of the generation change of the semiconductor memory devices, the next unit board can be connected to the mother board by selecting an appropriate terminal from connection terminals on the mother board.

Growing community of inventors

Tokyo, Japan

Takakazu Fukumoto