Tdk Corporation

Takahito Kiriyama

Seiichi Tajima

Akira Suzuki

Ikuo Katoh

Shigeru Sakano

A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.

Manufacturing method for a piezoelectric component

The invention is directed to piezoelectric device having a vibration space that achieves a high degree of airtightness which is not readily reduced, and a manufacturing method thereof. First and second hollow layers are formed at first and second surfaces of a piezoelectric substrate to form first and second cavities around first and second electrodes respectively. The first and second cavities each have a uniform width and extend between a first surface and an opposing second surface of the first and second hollow layers respectively, around vibration portions of the piezoelectric element. First and second sealing layers are each formed on the second surface of the first and second hollow layers to seal the first and second cavities.

Piezoelectric device with sealed vibration space and manufacturing method thereof

A piezoelectric component having resonance characteristics adjusted to a high degree of accuracy is provided. A piezoelectric substrate is provided with a resonating part. A deposit is added onto a surface of the resonating part and is provided with a plurality of indented portions at its surface enclosed by outer edges. The deposit is constituted of a resin which may contain a carbon filler. The indented portions are formed through laser machining.

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Tokyo, Japan

Takahito Kiriyama