Taiyo Yuden Co., Ltd.

Takahisa Fukuda

Satoshi Kobayashi

Kiyoshiro Yatagawa

Tomoaki Nakamura

Mikio Tahara

Naoki Saito

Mina Amano

Anju Okada

Ryosuke Hoshino

Toshiki Kondo

Junichi Shinozaki

Kazuyuki Koide

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape; and external electrodes each including a base layer, a conductive resin layer, and first and second conductive layers. A conductive filler includes a core portion and a silver coating film made of silver and covering the core portion. In a cross-section parallel to the first and second axes, when a straight line parallel to the first axis is drawn to pass through a range distant from a base end portion, and when a thickness of the first conductive layer along the line is a conductor thickness, and the sum of lengths of the silver coating film along the line in all the conductive fillers on the line is a total thickness of silver coating, a ratio of the conductor thickness to the total thickness of silver coating is 2 or more and 10 or less.

Multi-layer ceramic electronic component and circuit board

A ceramic electronic component includes an element body, a first external electrode, and a second external electrode. The element body includes a dielectric, at least one first internal electrode, and at least one second internal electrode laminated over the first internal electrode via the dielectric interposed therebetween. The element body has a top surface, a bottom surface, a pair of side surfaces, a first end surface, and a second end surface, thereby the element body having a generally cuboid shape. The first internal electrode is exposed on the first end surface. The second internal electrode is exposed on the second end surface. The side surfaces of the element body are concavely curved along a longitudinal direction, so that the element body has a longitudinal central part at which a width is less than a width at the end surface. The first external electrode is formed on the first end surface and electrically connected with the first internal electrode. The second external electrode is formed on the second end surface and electrically connected with the second internal electrode.

Ceramic electronic component, circuit substrate arrangement, and method of manufacturing ceramic electronic component

An electronic component includes an element body and at least one external electrode thereon. The element body has a dielectric and inner electrodes. Each external electrode includes a base layer connected to at least one the inner electrode. The base layer is formed on a plurality of surfaces of the element body and contains a metal and a first co-material mixed with the metal. Each external electrode also includes a plating layer formed on at least one face of the base layer. Each external electrode also includes an oxide layer formed on one or more faces of the base layer other than those faces of the base layer on which the plating layer is formed. The oxide layer has a surface layer made from an oxide film of the metal of the base layer and a second co-material.

Electronic component, circuit board arrangement and method of manufacturing electronic component

A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face; a first external electrode provided on the first end face; and a second external electrode provided on the second end face, wherein a silane film is provided on a surface of the ceramic electronic device, and wherein an organic compound is provided on the silane film, and has a siloxane bonding.

Ceramic electronic device

A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.

Multilayer ceramic capacitor having external electrodes provided with fluorine compound

An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.

Electronic component, circuit board arrangement, and method of manufacturing electronic component

A manufacturing method of a ceramic electronic device includes: preparing a ceramic electronic device having a multilayer chip, a first external electrode, and a second external electrode, and bonding an organic compound having a siloxane bonding to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, by contacting heated silicon rubber to the region.

Manufacturing method of ceramic electronic device

A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle &#x3b1; between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20&#xb0; or smaller, and a tip angle &#x3b2; between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20&#xb0; or smaller.

Ceramic electronic component and production method therefor

A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding.

Ceramic electronic device and manufacturing method of the same

Ceramic electronic component with crack protection and production method therefor

In an exemplary embodiment, a multilayer ceramic capacitor has, at two opposing respective end parts of a capacitor bodyof roughly rectangular solid shape, external electrodesthat each have a conductive resin layer Finside. Each of the external electrodescontinuously has an end face partcorresponding to one face, and a wraparound partcorresponding to four faces surrounding the one face, of the capacitor body. Also, the end face partof each of the external electrodeshas a bulging parton the outer face of the end face part. An electronic component using the multilayer ceramic capacitor can maximally prevent the Manhattan phenomenon that may otherwise occur when the electronic component is mounted on a circuit board, even though its external electrodes have the conductive resin layer inside.

Electronic component and electronic component mounting circuit board

In an embodiment, a capacitor bodyof the multilayer ceramic capacitorhas protective partsmade of ceramics, capacitance-forming partscomprising multiple internal electrode layersstacked together with ceramic layersplaced in between, and a non-capacitance-forming partmade of ceramics, in the order of 'protective part&#x2014;capacitance-forming part&#x2014;non-capacitance-forming part&#x2014;capacitance-forming part&#x2014;protective part' from one side to the other side along the laminating direction, and Trepresenting the thickness of each protective partin the laminating direction, Trepresenting the thickness of each capacitance-forming partin the laminating direction, and Trepresenting the thickness of the non-capacitance-forming partin the laminating direction, satisfy the relationship of 'T&#x3c;T&#x2264;T

Multilayer ceramic capacitor

A multilayer ceramic capacitor has a capacitor body of laminate structure and a pair of external electrodes, and shaped roughly as a rectangular solid defined by length L, width W, and height H. This multilayer ceramic capacitor is such that the width W and height H meet the condition of '1.10&#x2264;H/W&#x2264;1.70.'

A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A&#x2266;0.47 and condition C/A&#x2267;0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer.

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Takasaki, Japan

Takahisa Fukuda