Tokyo Ohka Kogyo Co., Ltd.

Takahiro Yoshioka

Hirofumi Imai

Koki Tamura

Atsushi Kubo

Takahiro Asai

Yoshihiro Inao

Yasumasa Iwata

Shingo Ishida

Yasushi Fujii

Akihiko Nakamura

Toshiyuki Ogata

Atsushi Miyanari

Shigeru Kato

Kimihiro Nakada

Hiroaki Takeuchi

Shinji Takase

A composition for forming a separation layer that separates a support base that transmits light from a laminate including the support base, a substrate, the separation layer and an adhesive layer between the support base and the substrate by irradiating the separation layer with light from the support base side and modifying the separation layer. The composition contains a resin component which has a phenol skeleton.

Composition for forming separation layer, support base provided with separation layer, laminate and method of producing same, and method of producing electronic component

An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23&#xb0; C., a storage modulus (G') of 1.5&#xd7;10Pa or less at 220&#xb0; C., and a loss factor (tan &#x3c3;) of 1.3 or less at 220&#xb0; C.; and (c) a thermal polymerization inhibitor.

Adhesive composition, adhesive film, and bonding method

A method of preparing a laminate, in which the laminate has a substrate and a support plate, and is provided with a release layer capable of being altered by irradiation with infrared ray, the method including forming the release layer on only a periphery of one of the substrate and the support plate; and laminating the substrate and the support plate through the release layer and a first adhesive layer.

Method of preparing laminate, and method of separating support

A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminate

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Adhesive composition, laminate, and stripping method

A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Bonding method

A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member.

Laminated body and method for separating laminated body

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Supporting member separation method

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

Laminate and method for separating the same

An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.

Adhesive composition

A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.

Support method, high-temperature treatment method using same, and support jig

Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

Adhesive composition, adhesive film, and method for treating substrate

The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.

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Kawasaki, Japan

Takahiro Yoshioka