Shin-Etsu Chemical Co., Ltd.

Takahiro Yamaguchi

Takafumi Sakamoto

Masayuki Ikeno

Tetsuro Yamada

Tadashi Araki

Mitsuhiro Iwata

Keita Kitazawa

Taiki Katayama

Akitsugu Fujiwara

Isao Iwasaki

Wataru Toya

Tomoki Akiba

Sawako Shoda

A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 μm or more and 2.0 μm or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 μm or less; and a production method of the thermal-conductive silicone composition.

Thermal-conductive silicone composition, production method therefor, and semiconductor device

This thermally conductive silicone composition contains: This thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 μm or less, and also has high durability.

Thermally conductive silicone composition, production method thereof, and semiconductor device

Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), Rand Rare each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond).

Silanol-group-terminated polyoxyalkylene compound and production process therefor, room-temperature-curable composition, sealing material, and article

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where Ris a monovalent hydrocarbon group, Ris an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa&#xb7;s at 25&#xb0; C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230&#xb0; C. and which has excellent heat-resistance.

Room temperature moisture-curable silicone gel composition, and cured product and article therefrom

Provided is a room temperature-curable organopolysiloxane composition for preventing aquatic organisms from adhering to and growing on an underwater structure. The composition comprises: wherein Rrepresents either a hydrogen atom or a monovalent hydrocarbon group that may have a substituent group, and n represents an integer of not smaller than 1; wherein Rrepresents either a hydrogen atom or a monovalent hydrocarbon group that may have a substituent group, Rrepresents either an alkyl group that may have a substituent group or a cycloalkyl group, and a represents an integer of 1 to 3;

Room-temperature-curable organopolysiloxane composition, and base member coated with cured object obtained from said composition

Provided is a room temperature-curable organopolysiloxane composition that is superior in fast curably, can form a cured product superior in storage stability and durability, and can further be produced in an industrially advantageous manner using more highly versatile materials. The room temperature-curable organopolysiloxane composition contains:  

Room temperature-curable organopolysiloxane composition and cured product thereof

Provided is a room temperature-curable resin composition containing an aluminum chelate compound. This aluminum chelate compound is an aluminum chelate compound having a &#x3b2;-dicarbonyl compound represented by the following general formula (1): wherein each of Rto Rrepresents a monovalent hydrocarbon group or a halogen atom; Rrepresents a hydrogen atom or a monovalent hydrocarbon group; and A is a group selected from a group represented by the following formula (2) and a group represented by &#x2014;OR: wherein each of Rto Rrepresents a monovalent hydrocarbon group or a halogen atom; and Rrepresents a monovalent hydrocarbon group.

Room temperature-curable resin composition containing an aluminum chelate compound

This room-temperature-curable organopolysiloxane composition includes: component (A); 0.1-30 parts by mass of component (B) per 100 parts by mass of component (A); and 0.001-20 parts by mass of component (D) per 100 parts by mass of component (A). Component (A) is an organopolysiloxane represented by general formula (1) (in general formula (1): Rrepresents hydrogen, or a substituted or unsubstituted C1-20 monovalent hydrocarbon group; the plurality of Rs may be the same or different; and n represents an integer of at least 1). Component (B) is an organic silicon compound which is represented by general formula (2), and which is characterized by having two silyl-vinylene groups provided to the same silicon atom (in general formula (2): Rrepresents hydrogen, or a substituted or unsubstituted C1-20 monovalent hydrocarbon group; the plurality of Rs may be the same or different; Rrepresents a substituted or unsubstituted C1-20 alkyl group, or a substituted or unsubstituted C3-20 cycloalkyl group; and a represents an integer from 1 to 3). Component (D) is a curing catalyst.

Room-temperature-curable organopolysiloxane composition, and moulded product comprising cured product of said room-temperature-curable organopolysiloxane composition

Provided is an organic silicon compound represented by the following general formula (1) (wherein Rrepresents either an alkyl group that has 1 to 20 carbon atoms and may have a substituted group or a cycloalkyl group that has 3 to 20 carbon atoms and may have a substituted group; Rrepresents either a hydrogen atom or a monovalent hydrocarbon group that has 1 to 20 carbon atoms and may have a substituted group, and Rmay be either identical or different; and each a independently represents an integer of 1 to 3). The novel silicon-containing compound of the present invention provides a cured product of a room temperature-curable organopolysiloxane composition that is particularly superior in fast curability.

Bis (alkoxysilyl-vinylene) group-containing silicon compound and production method of same

Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (wherein Rrepresents an alkyl group; Rrepresents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (wherein Rrepresents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa&#xb7;s at 25&#xb0; C.); and

Multicomponent room temperature-curable organopolysiloxane composition, cured product of said composition, and molded product comprising said cured product

Provided are: a novel organopolysiloxane compound containing a vinylene group, which can be used as a base polymer for an addition-curable silicone composition, particularly an organopolysiloxane compound containing a terminal vinylene group; and a method for producing the organopolysiloxane compound. An organopolysiloxane compound characterized by having at least one unit represented by formula (1) as a partial structure, and also characterized by being linear or branched. [R's independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms; R's independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, or a group represented by formula (a); x represents an integer of 0 to 1,998; R's independently represent a group represented by formula (a); R's independently represent a monovalent hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 2,000; and b represents an integer of 0 to 1,999.]

Organopolysiloxane compound and method for producing the same, and addition-curable silicone composition

A silicon-containing compound having an alkoxysilyl-ethylene group at its terminal including at least one silyl-ethylene bond represented by the following structural formula (a) in one molecule, and according to this compound, a novel base polymer used in a room temperature-curable polyorganosiloxane composition capable of providing a cured product that is particularly excellent in rapid curability, storage stability and durability can be provided. 

Silicon-containing compound having alkoxysilyl-ethylene group at its terminal, room temperature-curable organopolysiloxane composition, and molded product obtained by curing the composition

The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided. 

Organopolysiloxane compound having ethynyl groups, method for preparing linear organopolysiloxane compound having ethynyl groups at both terminals of molecular chain, method for preparing organopolysiloxane polymer having alkoxysilyl-ethylene group at terminal, room temperature curable composition and molded product which is cured product thereof

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Annaka, Japan

Takahiro Yamaguchi