Hitachi Metals, Ltd.

Takahiro Umeyama

Toshihiko Shimizu

Keiko Watanabe

Keisuke Fukamachi

Kengo Suzuki

Toshiaki Takai

Isao Sakaguchi

Takahiro Yamashita

Makoto Ohta

Yoshio Ozeki

In a flexible printed wiring board (), a first electrical conduction pattern () prepared on the first surface () on which a bare chip () is mounted is prepared only inside a mounting region () of the bare chip. Preferably, the first electrical conduction patterns () are prepared so as to avoid positions opposite to test electrodes () which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

Flexible printed wiring board, joined body, pressure sensor and mass flow controller

The present invention makes it possible to, even when a stainless steel is adopted in a diaphragm: prevent the diaphragm and a strain sensor from exfoliating from each other; be hardly susceptible to the influence of temperature in an operating environment; not allow the sensitivity of a pressure sensor to be dominated only by the mechanical characteristic of a material constituting the diaphragm; and increase the degree of freedom in design of members constituting the pressure sensor. A pressure sensor according to the present invention is, in order to solve the above problems, characterized in that: the pressure sensor has a diaphragm deforming by the pressure of a fluid, an elastic body covering the whole surface of the diaphragm and joining to the diaphragm on one side, and a strain sensor being arranged by joining on the other side of the elastic body and on an end side apart from a position corresponding to the center of the diaphragm and detecting the deformation of the elastic body working together with the deformation of the diaphragm as a strain; and the elastic body is formed of a material having a linear expansion coefficient close to the linear expansion coefficient of a material constituting the strain sensor.

Pressure sensor, differential pressure sensor, and mass flow rate control device using same

A flow rate control valve capable of eliminating an extra operation of a diaphragm spacer after a valve has become a closed state and shortening a response time is provided. It has an annular valve seat, a diaphragmincluding a thin plate-shaped elastic body an outer peripheral part of which has been fixed, and a diaphragm spacerlocated on the opposite side of the valve seatwith the diaphragminterposed therebetween, and the annular valve seat, the diaphragmand the diaphragm spacerare coaxially disposed. And, it is structured that the annular valve seathas, on its top, an inclined surfaceinclined to the inner peripheral side, and the diaphragmis displaced in a direction of the valve seatand the inclined surfaceon the top of the valve seatand the diaphragmabut against with no gap by pressing force of the diaphragm spacer

Flow rate control valve and mass flow controller using the same

A bandpass filter comprising two or more resonators arranged between two input/output terminals in a laminate substrate comprising pluralities of dielectric layers; each resonator being constituted by a resonance line and a resonance capacitance connected to one end of the resonance line; capacitance electrodes forming said resonance capacitances and said resonance lines being arranged on different dielectric layers, via a planar ground electrode covering the entire structural portion of the bandpass filter when viewed in a lamination direction; and in each of the resonators connected to said two input/output terminals, the junctions of said input/output terminals to said paths between said resonance lines and said resonance capacitances being closer to said resonance capacitances than said resonance lines in a lamination direction.

Bandpass filter, high-frequency device and communications apparatus

In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to 'a' &#x3bc;m, a thickness of the ceramic substrate is set to 'b' &#x3bc;m, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to &#x201c;c&#x201d; &#x3bc;m, a relationship of a&#x2267;269&#xd7;c/b+151 is established.

Growing community of inventors

Tottori, Japan

Takahiro Umeyama