Fujimi Incorporated

Takahiro Umeda

Shogo Onishi

Yoshihiro Izawa

Tatsuhiko Hirano

Shuichi Tamada

Kazuya Sumita

Yoshihiro Kachi

Takeshi Yoshikawa

To provide a novel polishing composition capable of improving the polishing speed of metal (particularly, tungsten) and maintaining stability as a composition. A polishing composition contains abrasive grains; quaternary amine having at least one alkyl group having 2 or more carbon atoms or a salt thereof; and a liquid carrier, wherein a pH of the polishing composition is from 2 to 5, and a zeta potential of the abrasive grains in the polishing composition is adjusted to 15 mV or more and less than 40 mV over the entire range of pH 2 to pH 4.

Polishing composition

[Problem] Provided is a polishing composition that can sufficiently maintain a high polishing rate for a barrier layer and an insulating film and suppress the occurrence of a surface defect such as erosion or fang. [Solution] Provided is a polishing composition which is used in the application to polish a polishing object having a barrier layer, a metal wiring layer and an insulating film, the polishing composition including abrasive grains, an oxidant, a metal corrosion inhibitor, a pH adjusting agent and water, in which an aspect ratio of abrasive grains is 1.22 or less and a ratio D90/D10 of a diameter D90 of particles when a cumulative particle weight from the fine particle side reaches 90% of the total particle weight to a diameter D10 of particles when the cumulative particle weight from the fine particle side reaches 10% of the total particle weight of the entire particles is 1.5 or more in a particle size distribution of the abrasive grains determined by a laser diffraction scattering method.

A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g&#xb7;solid or greater.

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Kiyosu, Japan

Takahiro Umeda