Japanese Organization for Medical Device Development, Inc.

Renesas Electronics Corporation

Renesas Technology Corp.

Takahiro Uchida

Shigeki Obayashi

Takeshi Iwamoto

Kazushi Kono

Toshiaki Yonezu

Masashi Arakawa

Shigeyuki Ozaki

The purpose of the present invention is to provide an implement for positioning electrocardiographic measurement electrodes, with which it is possible to rapidly determine electrocardiographic electrode positions customized for individual patients. This implement () is for positioning electrocardiographic measurement electrodes, and has a plurality of holes () corresponding to the positions of chest electrodes. The implement () preferably has a transparent front body section (). The front body section () preferably has a plurality of cut-out holes (). The implement () may have cut-out parts () that connect the plurality of holes.

Implement for positioning electrodes for 12-lead electrocardiogram

A training kit is provided for practicing aortic valve reconstruction. The aortic valve reconstruction training kit is provided with a blood vessel model and multiple valve leaflet models, and the blood vessel model has a base-capped or base-uncapped cylindrical form having an opening formed on at least the top part thereof. The blood vessel model also has a valve ring part which is formed in the middle of the cylinder and to which the valve leaflet models can be sutured. By using the training kit, it becomes possible to practice a suturing technique that is believed to be the most difficult in aortic valve reconstruction, namely, a technique of accurately suturing a new valve leaflet to a valve ring part, to which an abnormal valve leaflet has been attached, of a cylindrical aorta while viewing the inside of the aorta from above.

Aortic valve reconstruction training kit

In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.

Semiconductor device having electrical fuses with less power consumption and interconnection arrangement

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Tokyo, Japan

Takahiro Uchida