The Furukawa Electric Co., Ltd.

Murata Manufacturing Co., Ltd.

Takahiro Tsuruta

Takeo Uno

Sunao Fukutake

Yoshimasa Nishi

Yuko Okuno

Satoshi Yamazaki

Akitoshi Suzuki

Hirokazu Sasaki

Kensaku Shinozaki

Kimiko Fujisawa

Jun Shinozaki

Takeshi Ezura

Masato Ebisugi

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from &#x2212;0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.

Surface-treated copper foil, and copper-clad laminate and circuit board using same

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 &#x3bc;m or more and 0.30 &#x3bc;m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Surface-treated copper foil, and copper-clad laminate and printed wiring board using same

The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300&#xb0; C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300&#xb0; C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300&#xb0; C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

Electrolysis copper-alloy foil, method of the same, electrolytic-solution using the production, negative electrode aggregation used the same, secondary battery, and electrode of the same

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Tokyo, Japan

Takahiro Tsuruta