Samsung Electronics Co., Ltd.

The University of Tokyo

Takahiro Tokumiya

Tatsuya Ishimoto

Masato Kajinami

Shinji Ueyama

Naoyuki Takada

Daisuke Nagatomo

Yosuke Aoyagi

Masanori Izumita

Takeshi Nagahiro

Akihiro Komatsu

Fumitaka Moroishi

Ken Masamune

Takamasa Sugiura

YoungBum Kim

Joongha Lee

Siyang Zuo

Kazuo Iijima

Wen Xi Chen

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

Mounting device and mounting method

A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.

Chip peeling apparatus and chip peeling method using the same

A pressure heating apparatus that uniformly heats an object in a chamber in a short time includes a stage onto which the object is loaded; a heating light source that faces the stage, where the heating light source heats the object a non-contact manner while irradiating light onto the object; and a lower reflector disposed around the stage and that reflects light emitted from the heating light source toward the object.

Pressure heating apparatus

An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

Provided is a blood pressure measuring apparatus, a wrist watch type terminal, and a method of measuring blood pressure. The blood pressure measuring apparatus includes a light source that emits light onto a living body, a light receiver that receives light from the living body, and a signal processing device that calculates the blood pressure based on a detected signal received from the light receiver, wherein the signal processing device includes a subtractor that obtains a subtraction value by subtracting a moving average value of the detected signal in a second duration which is shorter than a first duration from a moving average value of the detection signal in the first duration, an extractor that extracts a feature point of a pulse wave based on the subtraction value, and a converter that converts a feature amount obtained based on the feature point to a blood pressure value.

Blood pressure measuring apparatus, wrist watch type terminal having the same, and method of measuring blood pressure

A method of fabricating a semiconductor device with improved quality and an encapsulant are provided. The method may include coating a chip wafer including a plurality of semiconductor chips with an encapsulant, performing a pre-curing process to bring the encapsulant into a B-stage, dicing the chip wafer to divide the chip wafer into a plurality of semiconductor chips, forming a chip stack by stacking the semiconductor chip on the base wafer in such a way that a coupling electrode on the base wafer and a bump electrode of each of the semiconductor chips face each other with a conductive adhesive element interposed therebetween, performing a reflow process on the chip stack under pressurized gas to bond the coupling electrode and the bump electrode to each other with the conductive adhesive element interposed therebetween, and performing a post-curing process on the chip stack under pressurized gas to bring the encapsulant into a C-stage.

Method of fabricating semiconductor device and encapsulant

A photoelectric sensor retainer and a photoelectric pulse wave measuring apparatus including the same are provided. The photoelectric sensor retainer includes a sensor mounting unit on which a photoelectric sensor having a light-receiving surface is attachable and detachable, the light-receiving surface facing a measuring direction. The photoelectric sensor retainer further includes a pressing unit configured to press an upper surface of the sensor mounting unit in the measuring direction to apply pressure to the sensor mounting unit, and a pedestal including a seating plate configured to support the pressing unit, the seating plate having a principal plane perpendicular to a pressing direction of the pressing unit.

Retainer for photoelectric sensor and photoelectric pulse wave measuring apparatus including the same

A medical tube which is highly flexible and has a very small diameter and a flexibility-variable mechanism having the medical tube are provided. The medical tube includes an interior tube and a plurality of annular segments of a cylindrical shape into which the interior tube is inserted. The medical tube is configured by sequentially connecting the plurality of annular segments while the interior tube is inserted inside of the plurality of annular segments. Each annular segment includes a fitting portion that allows any other annular segment to be fitted to the annular segment, and a fitted portion which may be fitted on the fitting portion of any other annular segment, which has a diameter that increases toward an end of the annular segment and includes at least one slit extending in a direction crossing a diametric direction. When the spacing of the slit is narrowed, the fitting portion of the annular segment and the fitted portion of any other annular segment are engaged with each other so that the annular segments are fixed to each other.

Growing community of inventors

Yokohama, Japan

Takahiro Tokumiya