Hitachi Chemical Company, Ltd.

Takahiro Tanabe

Hitoshi Onozeki

Atsushi Takahashi

Naoyuki Urasaki

Shin Takanezawa

Akishi Nakaso

Nozomu Takano

Kazunori Yamamoto

Shigeharu Arike

Kazuhito Kobayashi

Daisuke Fujimoto

Yasushi Kumashiro

Nobuyuki Ogawa

Kenji Takai

Norio Moriike

Koji Morita

Kazuhisa Otsuka

Toshihisa Kumakura

Takako Ejiri

Kiyoshi Saitou

Provided are a metal foil single-clad two-ply laminate which comprises two pairs of structures each comprising one prepreg or a laminate of two or more prepregs cladded with a metal foil on one surface thereof, wherein the two pairs of structures are laminated on each other through thermal compression via a release material put therebetween so that each prepreg faces inward, and wherein the release material is a film of a resin material or the like and its thickness is from 10 to 200 &#x3bc;m, and the thermal shrinkage of the release material at the temperature of the thermal compression treatment is at most 1.5%; and a method for producing the laminate. Also disclosed are a single-sided printed wiring board and its production method using the metal foil single-clad two-ply laminate.

Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

Growing community of inventors

Tochigi, Japan

Takahiro Tanabe