Mitsubishi Engineering-plastics Corporation

Mitsubishi Gas Chemical Company, Inc.

Mitsubishi Chemical Europe Gmbh

Takahiro Takano

Takahiko Sumino

Kentarou Ishihara

Jun Mitadera

Ryusuke Yamada

Masashi Kurokawa

Naohisa Akashi

Koji Yamamoto

Takeo Hayashi

Bernardus Antonius Gerardus Schrauwen

Teruhisa Kumazawa

Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

Polyamide resin composition and molded article

Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.

Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part

Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40&#xb0; C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140&#xb0; C.

Crystallizable thermoplastic resin composition and molded article

Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.

Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer

Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiOand AlOin a proportion of 60 to 70% by weight of SiOand 20 to 30% by weight of AlO.

Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10&#xb0; C./min, of 250&#xb0; C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.

Polyamide resin moldings

Provided is a thin-wall article formed from a polyamide resin which can be stably produced with little variation in mechanical properties such as flexural strength, flexural modulus and impact resistance. A thin-wall article formed by molding a polyamide resin (C) obtained by polycondensing a diamine (A) and a dicarboxylic acid (B) or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of a diamine structural unit is derived from xylylenediamine and the polyamide resin has a melt viscosity (i) of 50 to 200 Pa&#xb7;s as measured at a temperature of the melting point plus 10&#xb0; C. for a holding time of 6 minutes at a shear rate of 122 sec.

Thin-wall article

Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer

[Problems] Provided is a polyamide resin material having high elastic modulus, good gas barrier properties, low water absorption and excellent flexibility. [Means for solving the problems] This is a polyamide resin composition comprising a polyamide resin (A) composed of a diamine structural unit and a dicarboxylic acid structural unit wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid, and 1 to 40 parts by mass of at least one copolyamide (B) selected from the following group consisting of (B-1)-(B-3) per 100 parts by mass of the polyamide resin (A); (B-1): a copolyamide 6/66/12; (B-2): a copolyamide 6/66/11; (B-3): a polyether-polyamide copolymer composed of a polyamide 12 unit or a polyamide 11 unit and a polyether unit.

Polyamide resin compositions

The polyamide resin composition comprises a copolyamide resin, a nucleating agent for crystallization, and optionally an inorganic filler. The copolyamide resin is produced by polycondensing a carboxylic acid component mainly comprising adipic acid with a diamine component containing trans-1,4-bis(aminomethyl)cyclohexane, cis- 1,4-bis(aminomethyl)cyclohexane, and optionally another diamine. The nucleating agent for crystallization is selected from an organic nucleating agent and an inorganic nucleating agent. The polyamide resin composition exhibits a good molding cycle and provides a shaped article excellent in the retention of rigidity at a high temperature condition, the durability under a high temperature condition, and the retention of mechanical properties after water-absorption. Therefore, the polyamide resin composition is useful as a metal replacement in various applications such as automobile parts, mechanical parts and electric or electronic parts.

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Kanagawa, Japan

Takahiro Takano