Renesas Electronics Corporation

Renesas Technology Corp.

Takahiro Sugimura

Takafumi Betsui

Satoshi Imasu

Norihiko Sugita

Eiji Hayashi

The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor componentof WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor componentof CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-fillingandmutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components, and between the facing surfaces of the interposer substrate and semiconductor components, respectively.

Method of manufacturing a semiconductor device

The adhesive property of the mold resin exposed to the ball face side of a semiconductor package and under-filling resin is improved, and the manufacturing method of the semiconductor device which can prevent peeling at both interface is obtained. The sputtering step which does sputtering of the ball face side of the semiconductor package whose mold resin in which wax or fatty acid was included exposed to the ball face side by Ar plasma, the step which does flip chip junction of the semiconductor package at wiring substrate upper part after the sputtering step, and the step fills up with under-filling resin between the semiconductor package and the wiring substrate are included.

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Semiconductor device

Manufacturing method of semiconductor device

Growing community of inventors

Tokyo, Japan

Takahiro Sugimura