Fujikura Limited

Seikoh Giken Co., Ltd.

Takahiro Shimono

Hideo Shiratani

Takao Sato

Takeshi Ishizuka

Kenichi Ishibashi

Hideaki Usuda

Wataru Oishi

Tomomi Hirao

Ryosuke Niwaki

Masanobu Saruta

Ryo Iijima

Kazuhiro Domoto

An imaging module includes: an object lens; an image-sensing device; a holder that holds the object lens and the image-sensing device, the holder having a butt-contact portion with which the object lens is able to be brought into contact from an object side; and an aperture stop arranged closer to the object than the butt-contact portion, wherein an area that is to be light-shielded by an outer-periphery of the aperture stop is larger than an internal diameter of the butt-contact portion.

Imaging module and method of manufacturing the same

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135&#xb0; C. or less.

Imaging module and catheter with flexible wiring substrate

Imaging module for an endoscope

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.

Growing community of inventors

Sakura, Japan

Takahiro Shimono