Olympus Corporation

Takahiro Shimohata

Takatoshi Igarashi

Takuro Suyama

Hiroshi Kobayashi

Ken Yamamoto

Jumpei Yoneyama

An image pickup apparatus includes: an optical unit including an incident surface and an emission surface, in which a plurality of optical members are arranged around an optical axis; a polygonal prism image pickup unit including a light receiving surface, a rear surface and a plurality of side faces, in which a plurality of elements including an image pickup device configured to photoelectrically convert light made incident from the optical unit and output an image pickup signal are laminated; and at least one guide, a front portion of which is fixed to the emission surface of the optical unit and a rear portion of which is provided with a plurality of contact surfaces that are respectively in contact with and fixed to the plurality of side faces of the image pickup unit.

Image pickup apparatus and endoscope

An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

Image pickup module, fabrication method for image pickup module, and endoscope

An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.

Image pickup unit, endoscope, and method for manufacturing image pickup unit

An endoscope includes an image pickup apparatus disposed in a rigid distal end portion. The image pickup apparatus is provided with: an image pickup sensor with an external electrode being disposed on a rear face; a signal cable, a distal end portion of which is bonded to the external electrode of the imager; and resin sealing a bonding junction between the external electrode and the distal end portion, where the resin is accommodated in a space formed when the rear face is projected in a direction of an optical axis of the imager. A rear end position of the resin is defined by a resin stopping portion of the signal cable.

Image pickup module and endoscope including image pickup module in which bonding junction between image pickup portion and signal cable is resin-sealed by curable resin

An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

Image pickup module and endoscope

A lens unit includes a plurality of optical elements stacked, each of the plurality of optical elements including a glass substrate as a base, the glass substrates having a same size in respective cross-sections in a direction orthogonal to an optical path, and the optical elements are lens elements with resin lenses disposed on the respective bases, and each of the plurality of optical elements includes an annular recess portion surrounding the optical path and extending through the glass substrate, and a light shielding wall made of a light shielding material charged in the recess portion.

Optical unit for endoscope, endoscope and method for manufacturing optical unit for endoscope

An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.

Image pickup apparatus and method for manufacturing image pickup apparatus

A connection structure includes: a wiring board including a plurality of first electrodes that are arranged on a principal surface; a molded interconnect device (MID) made of a non-electroconductive resin as a base material, the MID including a side surface and a bottom surface, the bottom surface being parallel to the principal surface of the wiring board and including a plurality of arranged second electrodes, and the side surface being perpendicular to the principal surface of the wiring board; and a plurality of electroconductive members each made of an electroconductive paste, each of the electroconductive members electrically connecting each of the plurality of first electrodes to each of the plurality of second electrodes, in which the plurality of electroconductive members are housed in respective reservoir sections formed by the second member and are not in contact with the non-electroconductive resin.

Connection structure and image pickup apparatus

An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

Growing community of inventors

Shiojiri, Japan

Takahiro Shimohata