Felica Networks, Inc.

Jsr Corporation

Nitto-denko Corporation

Dai Nippon Printing Co., Ltd.

Shinkawa Ltd.

Daido Kogyo Co., Ltd.

Jm Energy Corporation

Takahiro Shimizu

Shigeki Wakasa

Jun Ogishima

Yukio Hosaka

Ryo Tanaka

Fujio Sakurai

Hiroshi Aoki

Hideo Kikuchi

Hidenori Suzuki

Kohei Seyama

Hironobu Machinaga

Nobuyuki Miyaki

Tomohiro Utaka

Kouji Senoo

Satoshi Shimobaba

Yoshio Shimada

Yuuichi Eriyama

Naoki Nagaoka

Motoki Okaniwa

Manami Kurose

Masahiro Yamamoto

Daisuke Nakamura

Taketo Ishikawa

Kenji Kojima

Yuji Machiya

Masato Nakatani

Yoshimasa Yamamoto

Takahiko Yanagitani

Kang Ko Chung

Hiroshi Kawai

Chikayuki Higashide

Megumi Nishino

Yoshihiro Kitamura

Yuichi Kintaka

Yasuo Jimbo

A piezoelectric device having a high conversion efficiency between electrical energy and mechanical energy is provided. The piezoelectric device has first electrode, a second electrode, and a piezoelectric layer provided between the first electrode and the second electrode, wherein the piezoelectric layer is formed of a ZnO-based material having a wurtzite crystal structure to which a metal that does not cause the piezoelectric layer to exhibit conductivity is added, and wherein a squared value of a electromechanical coupling coefficient in thickness vibration mode is 6.5% or more.

Piezoelectric device and method of manufacturing the same

A manufacturing apparatus () for manufacturing a semiconductor device includes: a wafer holding device (), a PU device () having a PU head () that holds a target chip () in a non-contact manner, an energy irradiation device () irradiating energy to the target chip () from a back surface side of a dicing tape () to reduce an adhesive force of the dicing tape (), and a controller (). An adhesive layer of the dicing tape () is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip () by a small distance. The controller () controls a position of the PU head () so that the target chip () and the PU head () do not come into contact with each other even if the target chip () floats during a takeoff preparation period.

Manufacturing apparatus of semiconductor device

An application providing system is provided. The application providing system includes a portable terminal device having an IC chip configured to perform radio communications; and a server device; the application providing system connecting the portable terminal device and the server device through a communication network, wherein the portable terminal device includes a transmitted message receiver section, an application determination section, an application transmission request generation section, and an application storage section, wherein the server device includes a transmitted message generation section, a transmitted message sender section, an application transmission request receiver section, an application storage section, and an application sender section.

Application providing system, portable terminal devices, server device, application providing method and computer programs

The present invention relates to an electrode material, an electrode, an electrical storage device and a lithium-ion capacitor, and the electrode material includes a carbon material and reduces its weight at a temperature not more than 650&#xb0; C. by 20% relative to the weight thereof before heating when thermogravimetric analysis is performed on the electrode material with a heating rate of 5&#xb0; C./min in an air flow at a rate of 100 ml/min.

Electrode material, electrode and electrical storage device

The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.

Production process for electrode material, electrode and electric storage device

Application providing system, portable terminal device, server device, application providing method and computer programs

System for managing LSI design part data

A stairway lift is provided on the treads of a stairway along a sidewall. A guide of the lift is provided on the treads along the sidewall so that a space is formed between the sidewall and the guide. The guide has a first side that faces the sidewall, a first rail provided on the first side, a chain rack on the first side that extends along the sidewall and a second side that faces away from the sidewall. A mobile body is supported by the first rail in the space formed between the sidewall and the guide. The mobile body has a drive sprocket engageable with the chain rack and an electric motor coupled with the drive sprocket for rotatively driving the drive sprocket. A carrier is provided for carrying a person or object to be moved along the stairway. A coupling arrangement couples the mobile body and the carrier so that the carrier is removably supported by the mobile body on the second side of the guide and guided for travel by the guide. The carrier can thus ascend and descend the stairway together with the mobile body.

Stairway lift

Growing community of inventors

Tokyo, Japan

Takahiro Shimizu