Nisshinbo Chemical Inc.

Nisshtnbo Chemical Inc.

Takahiro Sasaki

Ikuo Takahashi

Takahiko Itoh

Kenichi Yanagisawa

Shinichi Nakashima

Saori Kotani

Provided is a polyester resin composition that exhibits excellent hydrolysis resistance and generates little isocyanate gas when heated during melt kneading and molding. The polyester resin composition contains a polyester resin (A) and a carbodiimide compound (B) having a specific structure. The content of the carbodiimide compound (B) is 0.1 to 5 parts by mass relative to a total of 100 parts by mass of the polyester resin (A) and the carbodiimide compound (B).

Polyester resin composition

A polycarbodiimide compound represented by the following general formula (1): 

Polycarbodiimide compound and thermosetting resin composition

To provide a polycarbodiimide copolymer and a modified polycarbodiimide copolymer each suitable for a curing agent that can allow a cured product of a carboxy group-containing resin composition to be improved in flexibility without any loss of water resistance, as well as a curing agent of a carboxy group-containing resin composition, and a carboxy group-containing resin composition. The present invention enables a cured product to be enhanced in water resistance due to introduction of a predetermined soft segment into a polycarbodiimide molecule, in use for a curing agent, and also enables a carboxy group-containing resin composition to be enhanced in storage stability due to modification with an aliphatic amine or an aromatic heterocyclic amine.

Polycarbodiimide copolymer

The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with at least one aliphatic amine selected from the group consisting of diethylamine, methylisopropylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. The thermosetting resin composition of the present invention comprises a carboxyl group-containing resin having a carboxyl group in a molecule or an epoxy resin having two or more epoxy groups in one molecule, and the curing agent of the present invention. Thus, a modified polycarbodiimide compound that can allow a resin composition to be cured at a relatively low temperature and that can suppress curing of a resin composition in a drying step before a thermal curing step of a resin composition, a curing agent comprising the modified polycarbodiimide compound, and a thermosetting resin composition comprising the curing agent can be provided.

Modified polycarbodiimide compound, curing agent, and thermosetting resin composition

The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with an aromatic heterocyclic compound having endocyclic secondary amine nitrogen. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. Thus, a modified polycarbodiimide compound that allows amine dissociation to start at a low temperature as compared with a modified polycarbodiimide compound obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with diisopropylamine, and a curing agent comprising the modified polycarbodiimide compound can be provided.

The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

Growing community of inventors

Chiba, Japan

Takahiro Sasaki