Nissan Chemical Industries Limited

Hoya Corporation

Idemitsu Kosan Company, Limited

Nissan Chemical Corporation

Takahiro Sakaguchi

Tomoyuki Enomoto

Isao Adachi

Takahiro Kishioka

Hiroyuki Soda

Rikimaru Sakamoto

Masaki Nagai

Yuki Sugawara

Masahiro Hashimoto

Tetsuya Shinjo

Shojiro Yukawa

Satoshi Takei

Kiyohiko Yokota

Kiyokazu Katayama

Shinya Arase

Narinobu Kagami

Kanako Samejima

Takayuki Negi

Naoyuki Ueda

Kouta Oba

A saturated aliphatic hydrocarbon compound composition having an evaporation loss of 4% by mass or less as determined by the Noack method, a kinetic viscosity at 100° C. of 6.5 mm2/s or less, and an average carbon number of 36 to 44. A lubricating oil composition may contain such a saturated aliphatic hydrocarbon compound composition. A method for producing a saturated aliphatic hydrocarbon compound composition, may include: (1) oligomerizing an olefin to obtain an olefin oligomer; (2) isomerizing the olefin oligomer to obtain an isomer; and (3) hydrogenating the isomer.

Saturated aliphatic hydrocarbon compound composition, lubricant composition, and method for producing saturated aliphatic hydrocarbon compound composition

A resin composition capable of forming a cured film having a high refractive index, high transparency and high heat resistance, and a polymer which is used for the resin composition. A polymer having a structural unit of Formula (1): wherein Aand Aare each independently an &#x2014;O&#x2014; group or a &#x2014;C(&#x2550;O)O&#x2014; group; X is a divalent organic group having at least one aromatic ring or heterocyclic ring, wherein, when the X has two or more aromatic rings or heterocyclic rings, the rings are optionally bonded to each other via a single bond, are optionally bonded to each other via a heteroatom, or optionally form a condensed ring; and Y is a divalent organic group having at least one aromatic ring or condensed ring. A resin composition, includes: the polymer; a cross-linking agent; and a solvent.

Polymer and resin composition containing the same

A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: (wherein Ais a Cor Calkenyl group or alkynyl group, and Ais a Calkenylene group or alkynylene group).

Thermosetting resin composition

There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.0% by mass with respect to the content of all components of the resin composition, except the solvent: wherein Ris each independently a hydrogen atom or a methyl group, X is &#x2014;O&#x2014; or &#x2014;NH&#x2014;, Ris a single bond or an alkylene group, Ris an alkyl group, a is an integer of 1 to 5, b is an integer of 0 to 4, Ris a divalent organic group having an ether bond and/or an ester bond, Ris an alkyl group, f is an integer of 1 to 5, g is an integer of 0 to 4, Ris a single bond or an alkylene group, Y is a single bond or an ester bond, A is a mono- to tetra-valent organic group which optionally contain at least one hetero atom, or a hetero atom, and h is an integer of 1 to 4.

Resin composition

There is provided a resin composition for forming a color filter underlayer film that can form a cured film having excellent solvent resistance, heat resistance, and transparency and can reduce generation of the color resist residue at the time of formation of a color filter on the cured film. The resin composition for forming a color filter underlayer film comprising: a homopolymer or a copolymer having a structure unit of Formula (1); an acid compound; a solvent; and a crosslinking agent in an amount of 0% by mass to 35% by mass based on a content of a solid content of the resin composition: (where Ris a hydrogen atom or methyl group; Ris a Chydrocarbon group having at least one hydroxy group as a substituent; and the Chydrocarbon group further optionally has an ether bond).

Resin composition for forming color filter underlayer film

A thermosetting resin composition for a flattened film or a microlens including: a copolymer having structural units of the following Formulae (1) and (2), wherein Rs are each independently a hydrogen atom or a methyl group, Ris a single bond or a Calkylene group, in which the alkylene group may have an ether bond in the main chain, and Ris an epoxy group or a Corganic group having an epoxy ring; and a solvent. 

Resin composition for flattened film or microlens

There is provided a resin composition including a copolymer having structural units of Formula (1), Formula (2), and Formula (3), and a solvent; or a resin composition including a copolymer having structural units of Formula (1), Formula (4), and Formula (5), and a solvent. 

A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2): wherein each Ris independently a hydrogen atom or methyl group; X is an &#x2014;O&#x2014; group or an &#x2014;NH&#x2014; group; Ris a single bond or a Calkylene group; Ris a Calkyl group; a is an integer of 1 to 5, b is an integer of 0 to 4, and when a and b satisfy 1&#x2266;a+b&#x2266;5, and b is 2, 3, or 4, such Roptionally differ from each other; Ris a divalent organic group of Formula (I), Formula (II), or Formula (III), and Ris an organic group having an epoxy group: wherein c is an integer of 0 to 3, d is an integer of 1 to 3, and each e is independently an integer of 2 to 6; and a solvent.

Non-photosensitive resin composition

There is provided a photosensitive resin composition. A photosensitive resin composition including a component (A), a component (B); and a solvent, wherein the component (A) is a copolymer having a structural unit of Formula (1) and a structural unit of Formula (2): (where R0 is a hydroxy group or a carboxy group; R1 is a hydrogen atom or a methyl group; R2 is a single bond or a C1-5 alkylene group; R3 is a thermally cross-linkable monovalent organic group; and in a plurality of structural units of Formula (2), R1 are optionally different from each other), and the component (B) is a photosensitizer.

Photosensitive resin composition

There is provided a positive resist composition excellent in transparency, heat resistance, and refractive index particularly for forming a microlens and for forming a planarization film; and a microlens and a planarization film formed from the positive resist composition. A positive resist composition comprising a component (A): an alkali-soluble polymer comprising a unit structure having a biphenyl structure; a component (B): a compound having an organic group to be photolyzed to generate an alkali-soluble group; and a component (C): a solvent. The positive resist composition wherein the alkali-soluble polymer as the component (A) is a polymer comprising a unit structure of Formula (1): where when the total number of unit structures constituting the polymer (A) is assumed to be 1.0, the ratio n1 of the unit structure of Formula (1) constituting the polymer (A) satisfies 0.3&#x2266;n1&#x2266;1.0.

Positive resist composition and method for production of microlens

There is provided a photosensitive resin composition for forming a microlens. A photosensitive resin composition for forming a microlens, the photosensitive resin composition comprising: a component (A), a component (B), a component (C) and a solvent. The component (A) is a copolymer having a maleimide structural unit of formula (1) below, a vinyl ether structural unit of formula (2) below, and at least one of the three structural units of formula (3), formula (4), and formula (5) below, the component (B) is a photosensitizer, and the component (C) is a cross-linking agent (where X is a Chydrocarbon group that optionally has an ether bond or a cyclic structure; Y is an organic group that optionally has a substituent; and Z is an aromatic hydrocarbon group or an alkoxy group that optionally has a substituent).

Photosensitive resin composition for forming microlens

There is provided a resin composition. A resin composition includes: a copolymer having structural units of the following Formula (1), Formula (2) and Formula (3): where X is a Calkyl group, a Ccycloalkyl group, a phenyl group or a benzyl group, while the alkyl group, the cycloalkyl group, the phenyl group and the benzyl group optionally have a portion or all of the hydrogen atoms substituted with halogen atoms, carboxy groups, hydroxy groups, amino groups or nitro groups; each of Rs is independently a hydrogen atom or a methyl group; Ris a single bond or a Calkylene group; Ris a blocked isocyanate group; Y is an &#x2014;O&#x2014; group or an &#x2014;NH&#x2014; group; Ris a single bond or a Calkylene group; and Ris a Chydrocarbon group or a phenyl group having a hydroxy group as a substituent; and a solvent.

There is provided a photosensitive resin composition for a microlens. A photosensitive resin composition for a microlens, comprising a component (A), a component (B) and a component (C), wherein the component (A) is a polymer having a maleimide structural unit of Formula (1), the component (B) is a cross-linking agent, and the component (C) is a photosensitizing agent. 

Photosensitive resin composition for microlens

A material for a microlens having heat resistance, high resolution and high light-extraction efficiency is provided. A positive resist composition comprises an alkali-soluble polymer containing a unit structure having an aromatic fused ring or a derivative thereof, and a compound having an organic group which undergoes photodecomposition to yield an alkali-soluble group. The positive resist composition has coating film properties of a refractive index at a wavelength of 633 nm of 1.6 or more and a transmittance at wavelengths of 400 to 730 nm of 80% or more. A pattern forming method comprises applying the positive resist composition, drying the composition, exposing the composition to light, and developing the composition.

Photosensitive resin and process for producing microlens

There is provided a photosensitive resin composition for microlenses. A photosensitive resin composition for microlenses including a component (A), a component (B) and a solvent. The component (A): a copolymer having a maleimide structural unit of Formula (1) and a repeating structural unit of Formula (2). The component (B): a photosensitizer (in Formula (2), Ris a hydrogen atom or a methyl group; Ris a single bond or a Calkylene group; Ris a thermally cross-linkable monovalent organic group; and in the repeating structural unit of Formula (2), Rs are optionally different from each other).

Growing community of inventors

Funabashi, Japan

Takahiro Sakaguchi